Effect of free carbon dioxide on corrosion behavior of copper in simulated water

Sobue, Kazuharu; Sugahara, Akifumi; Nakata, Takeshi; Imai, Hachiro; Magaino, Shin’ichi

doi:10.1016/s0257-8972(03)00049-5

Cited by 18 publications

(12 citation statements)

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“…Copper is ubiquitous in numerous industries due to its relatively low cost coupled with its malleability and high electrical and thermal conductivities. It has uses in everything from residential and commercial plumbing [ 1 , 2 , 3 , 4 ] and electrical wiring to industrial heat exchangers [ 5 , 6 , 7 ] and high-powered electronics [ 8 , 9 , 10 , 11 ]. Copper possesses adequate aqueous corrosion resistance due to the formation of a semi-protective native oxide film.…”

Section: Introductionmentioning

confidence: 99%

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Investigation of the Corrosion Behavior of Atomic Layer Deposited Al2O3/TiO2 Nanolaminate Thin Films on Copper in 0.1 M NaCl

2019

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Fifty nanometers of Al2O3 and TiO2 nanolaminate thin films deposited by atomic layer deposition (ALD) were investigated for protection of copper in 0.1 M NaCl using electrochemical techniques. Coated samples showed increases in polarization resistance over uncoated copper, up to 12 MΩ-cm2, as measured by impedance spectroscopy. Over a 72-h immersion period, impedance of the titania-heavy films was found to be the most stable, as the alumina films experienced degradation after less than 24 h, regardless of the presence of dissolved oxygen. A film comprised of alternating Al2O3 and TiO2 layers of 5 nm each (referenced as ATx5), was determined to be the best corrosion barrier of the films tested based on impedance spectroscopy measurements over 72 h and equivalent circuit modeling. Dissolved oxygen had a minimal effect on ALD film stability, and increasing the deposition temperature from 150 °C to 250 °C, although useful for increasing film quality, was found to be counterproductive for long-term corrosion protection. Implications of ALD film aging and copper-based surface film formation during immersion and testing are also discussed briefly. The results presented here demonstrate the potential for ultra-thin corrosion barrier coatings, especially for high aspect ratios and component interiors, for which ALD is uniquely suited.

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Section: Introductionmentioning

confidence: 99%

“…Copper possesses adequate aqueous corrosion resistance due to the formation of a semi-protective native oxide film. Still, it corrodes at a finite rate and is susceptible to pitting dependent on solution constituents, pH, and temperature [ 2 , 3 , 4 , 12 , 13 , 14 , 15 , 16 ].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Corrosion Behavior of Atomic Layer Deposited Al2O3/TiO2 Nanolaminate Thin Films on Copper in 0.1 M NaCl

2019

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“…Copper is a common metal widely used in applications such as plumbing and heat exchangers. − While copper has a reasonable resistance to corrosion in liquid water, there is a finite corrosion rate, which decreases the life of the materials. The rate of copper corrosion is dependent on the water’s temperature, pH, and solutes. ,,− The application of barrier coatings on copper is one method to reduce corrosion.…”

Section: Introductionmentioning

confidence: 99%

Corrosion Protection of Copper Using Al₂O₃, TiO₂, ZnO, HfO₂, and ZrO₂ Atomic Layer Deposition

Daubert

Hill

Gotsch

et al. 2017

ACS Appl. Mater. Interfaces

152

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Atomic layer deposition (ALD) is a viable means to add corrosion protection to copper metal. Ultrathin films of AlO, TiO, ZnO, HfO, and ZrO were deposited on copper metal using ALD, and their corrosion protection properties were measured using electrochemical impedance spectroscopy (EIS) and linear sweep voltammetry (LSV). Analysis of ∼50 nm thick films of each metal oxide demonstrated low electrochemical porosity and provided enhanced corrosion protection from aqueous NaCl solution. The surface pretreatment and roughness was found to affect the extent of the corrosion protection. Films of AlO or HfO provided the highest level of initial corrosion protection, but films of HfO exhibited the best coating quality after extended exposure. This is the first reported instance of using ultrathin films of HfO or ZrO produced with ALD for corrosion protection, and both are promising materials for corrosion protection.

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“…Free carbon dioxide has long been associated with pitting (Rambow & Holmgren, 1966). Sobue et al (2003) provide experimental evidence that generalized corrosion of copper increases with the carbon dioxide content of the water and note that carbon dioxide can form carbonic acid in water (H 2 CO 3 ). They suggest that the resulting H + ions can act as electron acceptors in place of the traditional chlorine or oxygen.…”

Section: Article Impact Statementmentioning

confidence: 99%

A 30‐year review of copper pitting corrosion and pinhole leaks: Achievements and research gaps

Gibson

Karney

2021

AWWA Water Science

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Despite decades of research, the pitting of copper pipes is poorly understood. This article summarizes the key research findings from 1990 to the present and identifies research gaps. Several lines of evidence suggest that, for soft waters, additional alkalinity or maintaining a pH <8.5 may reduce copper pitting. Phosphate corrosion inhibitors, used to prevent lead corrosion, may also moderate copper pitting in low-alkalinity waters. However, such inhibitors could also exacerbate pitting due to insufficient coverage or could increase biological growth. Biological processes are likely involved in pitting corrosion, and practices to reduce biological growth may be beneficial. The research gaps identified include a need for better benchmarking, the effects of chemical transients (e.g., chlorine burns) and of hydraulic transients (e.g., water hammer), and changing the residual disinfectant from chlorine to chloramine.

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Effect of free carbon dioxide on corrosion behavior of copper in simulated water

Cited by 18 publications

References 0 publications

Investigation of the Corrosion Behavior of Atomic Layer Deposited Al2O3/TiO2 Nanolaminate Thin Films on Copper in 0.1 M NaCl

Investigation of the Corrosion Behavior of Atomic Layer Deposited Al2O3/TiO2 Nanolaminate Thin Films on Copper in 0.1 M NaCl

Corrosion Protection of Copper Using Al₂O₃, TiO₂, ZnO, HfO₂, and ZrO₂ Atomic Layer Deposition

A 30‐year review of copper pitting corrosion and pinhole leaks: Achievements and research gaps

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Effect of free carbon dioxide on corrosion behavior of copper in simulated water

Cited by 18 publications

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Investigation of the Corrosion Behavior of Atomic Layer Deposited Al2O3/TiO2 Nanolaminate Thin Films on Copper in 0.1 M NaCl

Investigation of the Corrosion Behavior of Atomic Layer Deposited Al2O3/TiO2 Nanolaminate Thin Films on Copper in 0.1 M NaCl

Corrosion Protection of Copper Using Al2O3, TiO2, ZnO, HfO2, and ZrO2 Atomic Layer Deposition

A 30‐year review of copper pitting corrosion and pinhole leaks: Achievements and research gaps

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Product

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Corrosion Protection of Copper Using Al₂O₃, TiO₂, ZnO, HfO₂, and ZrO₂ Atomic Layer Deposition