Purpose
This study aims to investigate the effect of incorporating cobalt (Co) into Sn-58Bi alloy on its phase composition, tensile properties, hardness and thermal aging performances. The fracture morphologies of tensile-tested solders are also investigated to correlate the microstructural changes with tensile properties of the solder alloys. Then, the thermal aging performances of the solder alloys are investigated in terms of their intermetallic compound (IMC) layer morphology and thickness.
Design/methodology/approach
The Sn-58Bi and Sn-58Bi-xCo, where x = 1.0, 1.5 and 2.0 Wt.%, were prepared using the flux doping technique. X-ray diffraction (XRD) is used to study the phase composition of the solder alloys, whereas scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) are used to investigate the microstructure, fractography and compositions of the solders. Tensile properties such as ultimate tensile strength (UTS), Young’s modulus and elongation are tested using the tensile test, whereas the microhardness value is gained from the micro-Vickers hardness test. The morphology and thickness of the IMC layer at the solder’s joints are investigated by varying the thermally aging duration up to 56 days at 80°C.
Findings
XRD analysis shows the presence of Co3Sn2 phase and confirms that Co was successfully incorporated via the flux doping technique. The microstructure of all Sn-58Bi-xCo solders did not differ significantly from Sn-58Bi solders. Sn-58Bi-2.0Co solder exhibited optimum properties among all compositions, with the highest UTS (87.89 ± 2.55 MPa) at 0.01 s−1 strain rate and the lowest IMC layer thickness at the interface after being thermally aged for 56 days (3.84 ± 0.67 µm).
Originality/value
The originality and value of this research lie in its novel exploration of the flux doping technique to introduce minor alloying of Co into Sn-58Bi solder alloys, providing new insights into enhancing the properties and performance of these solders. This new Sn-Bi-Co alloy has the potential to replace lead-containing solder alloy in low-temperature soldering.
