Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

Wang, Xinyue; Yang, Zhoudong; Wang, Boya; Chen, Wei; Zhang, Guoqi; Zhang, Jing; Fan, Jiajie; Liu, Pan

doi:10.1016/j.jmrt.2023.07.098

Cited by 6 publications

(1 citation statement)

References 41 publications

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“…This indicated the weak strength of those joints under thermal cycling, as shown in Figure 6b,d. In addition, the shear strength of the joints was compared with that of the sintered joints reported in recent studies [60][61][62][63][64][65][66][67][68][69]. Clearly, the joints showed a high shear strength and good reliability, showing their potential for packaging applications.…”

Section: Resultsmentioning

confidence: 96%

Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints

Tran,

Liu,

Chen

2024

Materials

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The effects of the sintering duration and powder fraction (Ag-coated Cu/SnAgCu) on the microstructure and reliability of transient liquid phase sintered (TLPS) joints are investigated. The results show that two main intermetallic compounds (IMCs, Cu6Sn5 and Cu3Sn) formed in the joints. The Cu6Sn5 ratio generally decreased with increasing sintering time, Cu powder fraction, and thermal treatment. The void ratio of the high-Cu-fraction joints decreased and increased with increasing sintering and thermal stressing durations, respectively, whereas the low-Cu-fraction counterparts were stable. We also found that the shear strength increased with increasing thermal treatment time, which resulted from the transformation of Cu6Sn5 and Cu3Sn. Such findings could provide valuable information for optimizing the TLPS process and assuring the high reliability of electronic devices.

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Section: Resultsmentioning

confidence: 96%

Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints

Tran,

Liu,

Chen

2024

Materials

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Residual Stress Characterization in Microelectronic Manufacturing: An Analysis Based on Raman Spectroscopy

Yang,

Wang,

Chen

et al. 2024

Laser & Photonics Reviews

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In the rapidly evolving era of information and intelligence,microelectronic devices are pivotal across various fields, such as mobile devices, big data computing, electric vehicles, and aerospace. However, the electrical performance of these devices often suffers due to residual stress from microelectronic manufacturing. This issue is compounded by the additional thermal stress that accumulates during device operation. Therefore, it is essential to understand, characterize, and control this residual stress to ensure the reliability and efficiency of microelectronic devices. Raman spectroscopy emerges as an invaluable tool for nondestructive, fast, noncontact, and precise testing of micro‐scale mechanics, significantly aiding in stress and strain analysis within microelectronic manufacturing. This article aims to provide a thorough overview of the theory and application beyond a mere compilation of recent advances. Theoretically, it critically evaluates existing models that describe the Raman‐stress relation. Practically, it explores the application of Raman spectroscopy in researching residual stress in various components, including substrate materials, epitaxial films, and packaging. Through a detailed examination of current applications, it highlights the significance of Raman spectroscopy in understanding micro‐scale mechanics. Finally, it offers both theoretical and practical insights into the future developments of Raman‐stress detection technology.

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Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering

Li,

Wang

et al. 2023

Journal of Materials Processing Technology

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Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

Cited by 6 publications

References 41 publications

Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints

Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints

Residual Stress Characterization in Microelectronic Manufacturing: An Analysis Based on Raman Spectroscopy

Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering

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