2017
DOI: 10.1039/c7py00063d
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Effect of epoxy monomer structure on the curing process and thermo-mechanical characteristics of tri-functional epoxy/amine systems: a methodology combining atomistic molecular simulation with experimental analyses

Abstract: A methodology, which combined molecular simulation with experimental research, was established to expound the performance of a tri-functional epoxy/amine system.

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Cited by 44 publications
(24 citation statements)
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References 72 publications
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“…MD simulation is a powerful tool for analyzing complex reaction behaviors, such as, those occurring in the epoxy curing process. Thus far, molecular structure analysis and mechanical/thermal property modeling by MD have been conducted, primarily focusing on EER = 1.0 3,5,17,18,19,20,21,22 . Portnow 23 made the first attempt to apply MD simulation to a reacting system in which two colliding hard sphere particles changed their identities each time to represent the reaction.…”
Section: Curing Simulationmentioning
confidence: 99%
See 1 more Smart Citation
“…MD simulation is a powerful tool for analyzing complex reaction behaviors, such as, those occurring in the epoxy curing process. Thus far, molecular structure analysis and mechanical/thermal property modeling by MD have been conducted, primarily focusing on EER = 1.0 3,5,17,18,19,20,21,22 . Portnow 23 made the first attempt to apply MD simulation to a reacting system in which two colliding hard sphere particles changed their identities each time to represent the reaction.…”
Section: Curing Simulationmentioning
confidence: 99%
“…The sequence of the reactions and the resulting properties vary depending on the curing process or conditions (temperature, heating rate, and time), 3,4 and several attempts have been made to elucidate the curing mechanisms and the associated material properties. 4,5,6 A threedimensional network structure exhibiting favorable mechanical properties can be obtained in thermosetting epoxy resins by applying an equivalent amount of the epoxy to the curing agent, defined as the amine/epoxy stoichiometric ratio.…”
Section: Introductionmentioning
confidence: 99%
“…When compared with the non‐covalent interaction, both epoxy molecules showed significantly higher interaction energy for covalent binding with MWCNT‐NH 2 , because the covalent model can lock epoxy molecules and the decrease the distances and interspaces between epoxy molecules and CNTs. Though Model II of MWCNT‐NH 2 /DGEAC exhibited a strong binding value of −221.1 kcal/mol, the reaction of Model II was more difficult to happen, because the ring‐opening process in alicyclic epoxy of DGEAC needed more energy . Therefore, the aromatic rings and nitrogen atom in the backbone of TGPAP resulted in a considerable higher interaction energy (–151.2 and −234.1 kcal/mol) with MWCNT‐NH 2 than that of the DGEAC (–139.7 kcal/mol) model.…”
Section: Resultsmentioning
confidence: 99%
“…First, a new kind of modifier for MMT was designed and synthesized by the nucleophilic addition reaction between TDE85 and the curing agent mPDA to reinforce the TDE85/mPDA epoxy resin, which exhibits small viscosity, good thermal stability, and high strength and has been widely used in many fields, such as for thermal resistant materials, composites, and adhesives . Different from the epoxy–monoamine adduct, the multifunctional reactants can retain the reactivity of the modifier with the matrix, but it is necessary to avoid crosslinking.…”
Section: Resultsmentioning
confidence: 99%