2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023
DOI: 10.1109/icept59018.2023.10491896
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Effect of Different Proportions and Powder Sizes of Sn on The Performance of Cu-Sn TLPB Joints

Yuyan Ding,
Tao Zhao,
Pengli Zhu
et al.
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