Abstract:The objective of this study is to empirically investigate the dependence of solder voids and related interconnect defects in QFN packages, on such design variables as stencil aperture pattern and size, as well as quantity and location of thermal vias. A non-traditional fractional-factorial matrix was used for this study. The QFN packages produced by implementing this experiment were analyzed using destructive and nondestructive failure analysis techniques. The effect of design variables on different types of d… Show more
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