Effect of DC current on tensile creep of pure tin

Zhao, Guangfeng; Yang, Fuqian

doi:10.1016/j.msea.2013.10.070

Cited by 38 publications

(12 citation statements)

References 42 publications

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“…Thus, it is unsurprising that the reported elastic modulus (E) ranges from 1.84 to 7.8 GPa, and the yield strength from 0.48 to 1.10 MPa [9][10][11]. Similar to other soft metals and alloys, such as Sn-alloys [12,13], indium [14] and lead [15], the deformation behavior of Li exhibits low yield strength and viscoplasticity. Because of the importance of viscoplastic behavior, we report, in this letter, nanoindentation measurements of Li performed in an argon-fill glove box.…”

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confidence: 99%

A nanoindentation study of the viscoplastic behavior of pure lithium

Wang

Cheng

2017

Scripta Materialia

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Applying mechanical stresses is a possible approach to suppress dendrite and mossy lithium (Li) in Li metal electrodes. We conducted, in this work, nanoindentation tests on pure Li metal in an argon-filled glove box to study its viscoplastic behavior at room temperature. Both load-controlled and strain rate-controlled nanoindentations showed clear viscoplastic characteristics of Li. Based on an iterative finite element (FE) modeling approach, we determined a viscoplastic constitutive law for Li. In addition, we demonstrated by FE modeling that elastic modulus, on the order of GPas, has a negligible influence on the nanoindentation response of Li at ambient temperature.

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confidence: 99%

A nanoindentation study of the viscoplastic behavior of pure lithium

Wang

Cheng

2017

Scripta Materialia

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“…From their experiments, they observed huge creep deformation at room temperature and creep stress exponent close to 1 which indicates atomic diffusion governs the overall creep process. This is unlike bulk Sn which observes dislocation climb with a typical stress exponent of ~3-7 and creep activation energy close to atomic self-diffusion[40,41]. Further evaluation with in-situ SEM creep tests confirmed it was due to lattice diffusion rather than coble creep that resulted in the behavior of the tin nanopillars.…”

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confidence: 87%

Probing Plasticity and Strain-Rate Effects of Indium Submicron Pillars Using Synchrotron Laue X-Ray Microdiffraction

Ali

Tamura

Budiman

2018

IEEE Trans. Device Mater. Relib.

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A nondestructive ex situ Synchrotron Laue X-ray Microdiffraction (µSLXRD) technique is used to investigate the plasticity mechanisms in the metallic nanostructures and their evolution at high homologous temperatures through analyzing low melting temperature metals such as tin. Without the use of expensive high temperature equipment, the current approach of studying plasticity mechanisms at high temperature is enabled by the low melting behaviors of the samples allowing them to provide insights on high temperature deformation mechanisms, such as thermally activated dislocation climbs. Nanopillars with a diameter near 1µm were deformed by uniaxial compression to strains of in excess of 20% at a strain rate of approximately 0.001s -1 .Defect density evolution in the nanopillars was evaluated by synchrotron Laue X-ray microdiffraction (µSLXRD) before and after deformation (ex situ). It was found from the Laue peak broadening measurements that there was no significant change in the dislocation density of the same pillar before and after such an extent of deformation. These findings were being compared to similar experimental results of indium and gold nanopillars (from our previous reports). They were found to be in stark contrast to our previous results with indium (although both are low melting temperature metals) where the synchrotron Laue X-ray microdiffraction showed significant peak broadening -before vs. after the uniaxial compression to a similar amount of deformation. It appears high temperature plasticity mechanism in tin nanostructures involves significant lattice diffusion behavior, as opposed to simple displactive behavior (through dislocation movements) that has been proposed in recent studies of tin nanostructures. AbstractA nondestructive ex situ Synchrotron Laue X-ray Microdiffraction (µSLXRD) technique is used to investigate the plasticity mechanisms in the metallic nanostructures and their evolution at high homologous temperatures through analyzing low melting temperature metals such as tin. Without the use of expensive high temperature equipment, the current approach of studying plasticity mechanisms at high temperature is enabled by the low melting behaviors of the samples allowing them to provide insights on high temperature deformation mechanisms, such as thermally activated dislocation climbs. Nanopillars with a diameter near 1µm were deformed by uniaxial compression to strains of in excess of 20% at a strain rate of approximately 0.001s -1 .Defect density evolution in the nanopillars was evaluated by synchrotron Laue X-ray microdiffraction (µSLXRD) before and after deformation (ex situ). It was found from the Laue peak broadening measurements that there was no significant change in the dislocation density of the same pillar before and after such an extent of deformation. These findings were being compared to similar experimental results of indium and gold nanopillars (from our previous reports). They were found to be in stark contrast to our previous results with indium (although both are low ...

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“…Nah J. W. et al [4] and Ren F. et al [5] observed ductile to brittle transition for the tensile fracture of solder joint when applying an high electric current passage on the solder joint. Su F. et al [6] , Kinney C. et al [7] and Zhao G. F. et al [8] found the creep rate would increase with the increase of electric current density, respectively. Kinney C. et al [7,9] attributed this phenomenon to temperature rather than EM because they thought EM might reduce the creep rate of solder joint.…”

Section: Introductionmentioning

confidence: 97%

“…Kinney C. et al [7,9] attributed this phenomenon to temperature rather than EM because they thought EM might reduce the creep rate of solder joint. But Zhao G. F. et al [8] considered this phenomenon resulted from the combination effect of Joule heating and EM. Liu H. Y. et al [10] reported stress-relaxation rate of tin-based solder joint increased significantly after current stressing.…”

Section: Introductionmentioning

confidence: 99%

Effects of electromigration on the creep of Sn0.3Ag0.7Cu solder joint

Zuo¹,

Ma²,

Guo³

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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For real solder joints used in electronic devices, EM and creep may be two relevant reliability problems because solder joints usually serves under a combination of current stressing, elevated temperatures, and mechanical loading conditions. Especially when the size of solder joints scales down and current density escalates, EM-induced microstructure change should have certain impact on creep behavior. In this study, we analyzed and discussed how EM influenced the creep behavior of lead-free solder joint from the perspective of EMinduced IMCs change. Behaviors of both interfacial and matrix IMCs were observed and attempt to reveal the roles they played in the failure of real lead-free solder joint. From this study we can conclude that: during EM, grain size of interfacial IMCs at both sides was increased, and the size at anode side was much larger. The shape of interfacial IMCs was changed from scallop shape to hexagonal prism. Besides, there were many Cu6Sn5 migrated into solder matrix. During creep, pre-EM process alleviated deformation of solder matrix and brought about brittle fracture of a solder joint.

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Effect of DC current on tensile creep of pure tin

Cited by 38 publications

References 42 publications

A nanoindentation study of the viscoplastic behavior of pure lithium

A nanoindentation study of the viscoplastic behavior of pure lithium

Probing Plasticity and Strain-Rate Effects of Indium Submicron Pillars Using Synchrotron Laue X-Ray Microdiffraction

Effects of electromigration on the creep of Sn0.3Ag0.7Cu solder joint

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