Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life

Hamasha, Sa’d; Akkara, Francy John; Su, Sinan; Ali, Haneen; Børgesen, Peter

doi:10.1109/tcpmt.2018.2795347

Cited by 30 publications

(2 citation statements)

References 30 publications

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“…The stress–life equation (power equation) shown in Eq. ( 2 ) is implemented to illustrate the relationship between fatigue life and stress level at different dwell times 25 . where J is the stress amplitude, N 63 is the characteristic life, and U and c are the equation constants.…”

Section: Methodsmentioning

confidence: 99%

Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints

Hani

Athamneh

Abueed

et al. 2023

Sci Rep

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The accuracy of reliability models is one of the most problematic issues that must be considered for the life of electronic assemblies, particularly those used for critical applications. The reliability of electronics is limited by the fatigue life of interconnected solder materials, which is influenced by many factors. This paper provides a method to build a robust machine-learning reliability model to predict the life of solder joints in common applications. The impacts of combined fatigue and creep stresses on solder joints are also investigated in this paper. The common alloy used in solder joint fabrication is SAC305 (Sn–Ag–Cu). The test vehicle includes individual solder joints of SAC305 alloy assembled on a printed circuit board. The effects of testing temperature, stress amplitude, and creep dwell time on the life of solder joints were considered. A two-parameter Weibull distribution was utilized to analyze the fatigue life. Inelastic work and plastic strain were extracted from the stress–strain curves. Then, Artificial Neural Networks (ANNs) were used to build a machine learning model to predict characteristic life obtained from the Weibull analysis. The inelastic work and plastic stains were also considered in the ANN model. Fuzzy logic was used to combine the process parameters and fatigue properties and to construct the final life prediction model. Then a relationship equation between the comprehensive output measure obtained from the fuzzy system and the life was determined using a nonlinear optimizer. The results indicated that increasing the stress level, testing temperature, and creep dwell time decreases reliability. The case of long creep dwell time at elevated temperatures is worst in terms of impact on reliability. Finally, a single robust reliability model was computed as a function of the fatigue properties and process parameters. A significant enhancement of the prediction model was achieved compared to the stress–life equations.

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Section: Methodsmentioning

confidence: 99%

Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints

Hani

Athamneh

Abueed

et al. 2023

Sci Rep

View full text Add to dashboard Cite

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“…The reliability of microelectronic packaging usually depends on the fatigue life of the solder joints [54], which can be predicted by experimental observation and empirical mathematical models [55].…”

Section: Research Methods For Fatigue Failure Of Bga Solder Jointsmentioning

confidence: 99%

Survey on Fatigue Life Prediction of BGA Solder Joints

et al. 2022

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With the development of science and technology, consumers’ requirements for various electronic devices present a trend of more diverse functions and thinner bodies. This makes integrated circuits mounted in electronic products and their packaging more vital to satisfying the above requirements. Ball grid array (BGA) packaging is widely used in the field of microelectronic manufacturing industries due to its multiple I/O volumes and excellent electric characteristics. However, due to environmental loads such as vibration and impact during its production and application, defects inevitably emerge in BGA solder joint defects, which will lead to the failure of electronic products. This article summarizes the state-of-the-art research on the factors, analysis methods, and models for the fatigue failure of BGA chips. After rigorous discussions concerning this research, some theoretical suggestions are provided for BGA packaging in reliability analysis and the establishment of evaluation standards.

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