Effect of Current Density Distribution in the Zinc Plating Process

Abstract

This paper presents an analysis of the current density distribution in the zinc plating process, using a two-dimension approach. The simulation presents a model based on COMSOL Multi-physics software. The simulation neglected the effect of mass transfer and production of gaseous species, in order to simplify the resolution. Additionally, a validation from the simulation through a comparison with the experimental data at similar conditions was performed. The results presented a good agreement between the experimental and simulated data. The graphics from both approaches showed a decreasing trend in the current density along the cathode length. This trend arises from the electrons movement in the electrodes; electrons flow through the least resistive path. Given the fact that zinc electroplating incurs an important industrial application, simulation is becoming a promising way to optimization and improvement.