Effect of Curing Time and Temperature on the Structural Stability of Melamine Formaldehyde Polymers

Katekomol, Phisan

doi:10.4028/www.scientific.net/amm.855.131

Cited by 4 publications

(3 citation statements)

References 10 publications

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“…31,32 Furthermore, the cross-linked network created by EP and PEG likewise becomes more compact during the strong crosslinking. 33 Transparent TPE−TES (Figure 1d) with a practical thickness (2 mm) under phase change temperature was synthesized utilizing the high-temperature curing agent MeH-HPA, based on the hypothesis of energy-driven structural rearrangement.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

“…The smaller sized PEG segment is more flexible than the EP segment, and its thermal movement can cause the EP skeleton to move during the curing process when driven by high temperature . The continuous energy supply and extended cross-linking process allow the PEG/EP composite to undergo a more thorough structural rearrangement, eliminating large-scale heterogeneity and progressively producing a homogeneous tiny isotropic domain. , Furthermore, by changing the abovementioned curing parameters ( t curing and T curing ), it is possible to provide the system with the right external energy (heat) to diffuse and migrate the atoms (clusters) toward tiny clusters with low Gibbs free energy on the surface, intermolecular and van der Waals forces are weakened, and the material eventually exhibits a smooth and continuous distribution of uniform and small sizes, similar to the epitaxial mechanism of thin films under vacuum. , Furthermore, the cross-linked network created by EP and PEG likewise becomes more compact during the strong cross-linking . Transparent TPE–TES (Figure d) with a practical thickness (2 mm) under phase change temperature was synthesized utilizing the high-temperature curing agent MeH-HPA, based on the hypothesis of energy-driven structural rearrangement.…”

Section: Resultsmentioning

confidence: 99%

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Novel Biphasically and Reversibly Transparent Phase Change Material to Solve the Thermal Issues in Transparent Electronics

Zhang

Wang

Sun

et al. 2022

ACS Appl. Mater. Interfaces

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Highly integrated transparent electronic systems are experiencing significant thermal bottlenecks due to the rapid growth of transparent electronics and the lack of suitable transparent thermal management solutions. Therefore, transparent thermal management materials are highly desirable in modern transparent electronics. Based on the phase change properties of polyethylene glycol (PEG) and the encapsulable properties of epoxy resin (EP), we synthesize a biphasically and reversibly transparent PEG/EP composite for thermal energy storage (TPE− TES). Energy-driven structural rearrangements in cross-linked networks are responsible for the high transparency with practical thickness. According to SEM and TEM investigations, PEG and EP achieve submicron phase dispersion, while TPE−TES forms a smooth and continuous surface that suppresses diffuse reflections and contributes to improved visible light penetration. The unique combination of phase change and optical transparency gives TPE−TES the ability to regulate thermal storage, rapid temperature change, and spatial temperature uniformity of transparent electronics. Due to its flexibility, stability, and processability, TPE−TES is also suitable and ideal as thin surface coating films or thick transparent flexible substrates for a wide range of applications in the integration of electronic devices.

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Section: ■ Results and Discussionmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Novel Biphasically and Reversibly Transparent Phase Change Material to Solve the Thermal Issues in Transparent Electronics

Zhang

Wang

Sun

et al. 2022

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

show abstract

“…The maximum weight loss rate temperature for both MFF and MFF‐TFMB fibers occurred at 375–395°C, mainly due to the decomposition of the triazine ring 35 . The fourth stage of weight loss corresponds to further thermal degradation of the molecular structure in the fiber 36 . Combined with the data in Table 3, the maximum weight loss rate temperatures corresponding to MFF, MFF‐TFMB‐1%, MFF‐TFMB‐3%, and MFF‐TFMB‐5% are 379.6, 378.2, 380.3, and 381.5°C, respectively.…”

Section: Resultsmentioning

confidence: 99%

Preparation of poly(melamine‐formaldehyde‐2,2′‐bis(trifluoromethyl)benzidine) high‐performance fibers

Liu

Chen

et al. 2022

J of Applied Polymer Sci

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Melamine formaldehyde fiber is widely used in various fields because of its excellent heat resistance and flame‐retardant properties. In this study, melamine and paraformaldehyde are used as the main raw materials, 2,2′‐bis(trifluoromethyl)benzidine (TFMB) is successfully introduced into the molecular chain. The TFMB modified spinning solutions (MF‐TFMB) are obtained by one‐step copolymerization, the TFMB‐modified melamine‐formaldehyde fibers (MFF‐TFMB) are prepared by dry spinning. The surface contact angle and surface energy are measured by a contact angle measuring instrument. The thermal stability and mechanical properties of the fibers are measured by a thermogravimetric analyzer and a single‐fiber strength tester. The results show that the introduction of the TFMB group reduces the surface free energy of the polymer and effectively improves the heat resistance and mechanical properties of the fiber. When the addition amount of TFMB is 3%, the MFF‐TFMB‐3% fiber has smooth surface and bubble‐free inside, the breaking strength is 2.25 cN/dtex and the elongation at break is 11.85%. The limiting oxygen index is 32.5%, and the mass loss rate is decreased from 63.88% to 51.36% at 400°C. The fiber has excellent thermal stability and flame‐retardant properties.

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Preparation and characterization of high‐performance fibers copolymerized by melamine formaldehyde with 1,4‐cyclohexanedimethanol

Liu

Chen

et al. 2021

J of Applied Polymer Sci

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The melamine formaldehyde (MF) resin fiber has been used in various fields due to its excellent heat resistance, but it's mechanical properties still need to be improved. Using melamine and paraformaldehyde as raw materials, 1,4-cyclohexanedimethanol (CHDM) as the comonomer, a series of modified fibers with different copolymerization ratios are prepared by dry spinning. The research results show that melamine, paraformaldehyde, and CHDM can copolymerize by one-step. The introduction of CHDM can effectively improve the heat resistance and mechanical properties of the fiber. When the addition amount of CHDM is 6%, the copolymeric fibers are cylindrical with a smooth surface and bubble-free inside, the breaking strength is 1.80 cN/dtex and the elongation at break is 13.75%. Compared with the unmodified fiber, the breaking strength is decreased by approximately 5%, and the breaking elongation is increased by nearly 90%. The thermal properties of the copolymeric fibers are not decreased, and the mass residual rate at 400 C is increased from 36.12% to 46.11%. This study provides a method of copolymeric-modified without fiber-forming aid to prepare high-performance MF fibers.

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Effect of Curing Time and Temperature on the Structural Stability of Melamine Formaldehyde Polymers

Cited by 4 publications

References 10 publications

Novel Biphasically and Reversibly Transparent Phase Change Material to Solve the Thermal Issues in Transparent Electronics

Novel Biphasically and Reversibly Transparent Phase Change Material to Solve the Thermal Issues in Transparent Electronics

Preparation of poly(melamine‐formaldehyde‐2,2′‐bis(trifluoromethyl)benzidine) high‐performance fibers

Preparation and characterization of high‐performance fibers copolymerized by melamine formaldehyde with 1,4‐cyclohexanedimethanol

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