Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints

Park, Jae Yong; Seo, Wonil; Yoo, Sehoon; Kim, Young-Ho

doi:10.1016/j.jallcom.2017.07.072

Cited by 16 publications

(5 citation statements)

References 19 publications

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“…3b, c. In addition, the strength of solder joint which fractured inside the solder matrix is higher than that of the solder joint which fractured inside the interfacial IMC layer [27][28][29], and the subsequent record results about shear strength are also in agreement with previous research.…”

Section: Shear Fracture Behavior Of Sac305/cu Solder Jointssupporting

confidence: 90%

“…Firstly, the shear strength of solder joint increased due to the pinning effect of IMC and then decreased due to the brittle fracture caused by the excessive growth of IMC. In the previous study of Park [29], the same phenomenon that the solder joint strength firstly increased and then decreased in the solid-state aging processes has been presented also.…”

Section: The Mechanical Properties Of Solder Joints After Various Aging Timesmentioning

confidence: 61%

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Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

et al. 2020

J Mater Sci: Mater Electron

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Coating at the interface of solder joint has a great impact on the growth behavior of intermetallic compounds (IMCs) and the mechanical properties. In this study, the sandwich structure samples of Cu/Sn3.0Ag0.5Cu/Cu solder joints with coatings of Ni(P) monolayer and dual Cu-Ni(P) layers on Cu substrate were designed to conduct the shear test. The mechanical strength, fracture modes, and fractographic morphologies of Sn3.0Ag0.5Cu/Cu, Sn3.0Ag0.5Cu/Ni(P)-Cu, and Sn3.0Ag0.5Cu/Cu-Ni(P)-Cu solder joints reflowed at 280 °C for 10 min and then aged at 150 °C for up to 360 h were investigated. Experimental results show that the mechanical strength of Sn3.0Ag0.5Cu/Cu solder joints firstly increased because of the pinning effect of IMC, and then decreased due to the brittleness of excessive growth of IMC during solid-state aging processes. The Sn3.0Ag0.5Cu/Cu solder joints presented ductile fracture, mixed fracture, and brittle fracture modes during shear testing processes. The shear strength of Sn3.0Ag0.5Cu/Ni(P)-Cu solder joints decreased to about 17 MPa after 120 h thermal aging. At the same time, the shear failure mode of Sn3.0Ag0.5Cu/Ni(P)-Cu solder joints changed from the ductile dominant fracture to the brittle dominant fracture. The shear strength of Sn3.0Ag0.5Cu/Cu-Ni(P)-Cu solder joints remained approximate 21 MPa and the fractured position always occurred inside the IMC layer regardless of aging time.

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Section: Shear Fracture Behavior Of Sac305/cu Solder Jointssupporting

confidence: 90%

Section: The Mechanical Properties Of Solder Joints After Various Aging Timesmentioning

confidence: 61%

Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

et al. 2020

J Mater Sci: Mater Electron

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“…Sn-based materials have been investigated for numerous applications such as next-generation rechargeable Li-ion batteries and lower-melting-point solders. − Particularly, Sn is unique as a promoter in catalyst formulations to achieve high activity and selectivity. − Typically, catalysts such as Pt and Pd can be modified by the addition of Sn, and thus exhibit significantly enhanced catalytic performance. − Despite Sn-containing catalysts being well-documented, − Sn-nanostructure-supported catalysts still have not been investigated. There are only a handful of reported articles that involve Sn nanostructures synthesized by either the physical method with special apparatus and high temperature or chemical process with tedious steps or rigorous conditions. , It is challenging but desirable to develop facile routes to synthesize Sn nanostructures, which can provide a great facility to formulate Sn-based nanomaterials.…”

Section: Introductionmentioning

confidence: 99%

Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks

Xie

et al. 2018

ACS Appl. Nano Mater.

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The applications of tin are extremely wide-ranging, in fields as diverse as Li-ion batteries, catalysis, and electronic packaging. It is always significant but still remains a great challenge to develop facile and efficient routes to synthesize Sn nanostructures. Herein, we report a facile chemical method to synthesize a Sn nanorod crystal at room temperature, and Ag ions are subsequently introduced to form the Sn-nanorod-supported Ag nanoparticles hybrid structure (Sn/Ag nanorods). The Sn/Ag nanorods exhibit comparable activity to the commercial Pd black in catalyzing the electroless copper deposition (ECD) reaction that is indispensable to fabricate printed circuit boards (PCBs). Furthermore, a screen printable adhesive is prepared by mixing the as-synthesized Sn/Ag nanorod powders and epoxy resin to fabricate activator patterns on epoxy laminate (EPL) and flexible substrates including polyethylene terephthalate (PET) and polytetrafluoroethylene (PTFE) fiber film. The printed areas are finally metalized by the ECD process to obtain the copper coatings with designed patterns that are confirmed to exhibit excellent electrical conductivity and flexibility.

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“…Subsequently, the electrode was rinsed with Barnstead Nanopure water (resistivity >18.2 MΩ cm) and dried with high-purity N 2 gas (containing less than 1 ppb of O 2 , CO, CO 2 , and moisture content). Furthermore, WE preparation details can be found elsewhere . A silver/silver chloride, Ag/AgCl/KCl (3 M) electrode (+0.222 V vs SHE) was consistently used as RE and all potentials were measured and reported versus said RE.…”

Section: Methodsmentioning

confidence: 99%

“…Furthermore, WE preparation details can be found elsewhere. 21 A silver/silver chloride, Ag/AgCl/KCl (3 M) electrode (+0.222 V vs SHE) was consistently used as RE and all potentials were measured and reported versus said RE. Finally, a high-purity Pt wire (99.99%), etched in 5 M HNO 3 and thoroughly rinsed with Barnstead Nanopure water prior to each experiment, served as CE.…”

Section: ■ Experimental Sectionmentioning

confidence: 99%

Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel

Lei,

Borgesen,

Dimitrov

2024

ACS Appl. Electron. Mater.

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Soldering onto nickel (Ni) pads almost invariably results in the formation of submicroscopic voids between intermetallic compound (IMC) Ni 3 Sn 4 and the solder. However, these voids remain virtually undetectable until the IMC reaches a thickness exceeding 5 μm. At that point, they become a concern for joints' conductivity and reliability, especially upon high-temperature exposure during operation. Previously, this issue was regarded as unavoidable, but our research has revealed a connection to impurities introduced during the plating process. The present study aims to understand the underlying cause of void formation by investigating the influence of various factors, such as Ni electrodeposition parameters, deoxygenation, and deliberate modifications to the electrolyte composition. Our findings indicate that impurities, likely in the form of Ni(OH) 2 or NiOOH, undergo gasification during the reflow process, thus initiating the nucleation of interfacial voids. With the IMC layer development, these voids grow, driven by Kirkendall vacancy formation and possibly amplified by mismatch stresses between the solder and IMC. To assess the impurity content, we utilized void volume as an indicator, and composition analysis was employed to examine the electrodeposited Ni for the presence of oxygen and fractions of ionized Ni species. Confirmation of the presence of oxidized Ni inclusions was obtained through thermogravimetry and X-ray photoelectron spectroscopy.

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Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints

Cited by 16 publications

References 19 publications

Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks

Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel

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