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2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2020
DOI: 10.1109/ipfa49335.2020.9261015
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Effect of Cu barrier from TaN/Ta Deposition barrier(DD) & TaN/Etching/Ta Deposition barrier(DED) on Cu EM reliability

Yun-Chi Liao
1
,
Hui-Lan Sung
2
,
Weilin Wang
3
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