Effect of CTAB on the architecture and hydrophobicity of electrodeposited Cu–ZrO2 nano-cone arrays

Tailoring the Surface Morphology of a Nanostructured CuCo2S4 Electrode by Surfactant-Assisted Electrodeposition for Asymmetric Supercapacitors with High Energy and Power Density

“…Furthermore, during the electrodeposition process under the cathodic potential range (−1.2 V), the micelle formation due to the electrostatic attraction creates a charged environment on the neutral nuclei, which promotes particle area coverage of the material on the electrode surface in a homogenous manner. During the annealing process, CTAB was used to decompose into water and CO 2 , which also promotes the porous nature of the electrode material. − …”

Synthesis of a high-fastness cationic silica/fluorine-free acrylate water repellent and its application in fabrics

“…[7][8][9] Nevertheless, they are not viable for mass production, expensive, and harmful to the fabric during processing. Roughness can also be provided by micro and nanoparticles on the surface of materials by spraying, [10][11][12] dip coating, [13][14][15] self-assembly, 16 and deposition methods, [17][18][19][20] which are reliable and effective.…”

Structural Control of Electrodeposited Sb Anodes through Solution Additives and Their Influence on Electrochemical Performance in Na-Ion Batteries

“…A brightener can inhibit the rate of the electrodeposition by interacting with the electrode surface and preventing the deposition of the active ion in that area . As a result, brighteners can also help level the micro profile of the electrode surface without the need for polishing after the deposition. , Additives, such as bis­(3-sulfopropyl) disulfide (SPS) that acts a brightner, − and sodium gluconate, , are typically used in copper and nickel plating baths, respectively, and an extensive library of additives have been investigated for other metal depositions. ,, Surfactants, such as cetyltrimethylammonium bromide (CTAB), have also been used in deposition baths due to their potential to affect the surface tension between the electrolyte and the electrode and can have effects on coating adhesiveness and morphology at varying concentrations. , Depending on the interactions of CTAB with the substrate or the active metal being deposited, it may act as a leveling or brightening agent. − Additonally, CTAB can interact directly with the deposited metal instead of the substrate and has been used to cap the growth of particles as demonstrated in nanoparticle synthesis − and also has the potential to act as a corrosion inhibitor . Despite the tunability that can be acheived through these organic additives, there are few publications reporting the tunability of electrodeposited Sb anodes for battery applications using solution additives. , …”

“…36,43,44 Surfactants, such as cetyltrimethylammonium bromide (CTAB), have also been used in deposition baths due to their potential to affect the surface tension between the electrolyte and the electrode and can have effects on coating adhesiveness and morphology at varying concentrations. 45,46 Depending on the interactions of CTAB with the substrate or the active metal being deposited, it may act as a leveling or brightening agent. 47−49 Additonally, CTAB can interact directly with the deposited metal instead of the substrate and has been used to cap the growth of particles as demonstrated in nanoparticle synthesis 50−52 and also has the potential to act as a corrosion inhibitor.…”