2014
DOI: 10.1016/j.nimb.2014.04.004
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Effect of crystal orientation on low flux helium and hydrogen ion irradiation in polycrystalline tungsten

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Cited by 32 publications
(6 citation statements)
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“…For each sample, lateral grain size determination was done for at least 40 grains. As the sputtering process/channeling depends on the crystallographic grain orientations because of different surface BEs of surface atoms and different open channels, 39 XRD analysis was performed to investigate the texture of the Au films. In Figure 4, the result obtained for the virgin Au/Cr sample is plotted as a map of ω − 2θ scans in dependence of the tilt angle ψ (sample Au/Ti shows similar results).…”
Section: Resultsmentioning
confidence: 99%
“…For each sample, lateral grain size determination was done for at least 40 grains. As the sputtering process/channeling depends on the crystallographic grain orientations because of different surface BEs of surface atoms and different open channels, 39 XRD analysis was performed to investigate the texture of the Au films. In Figure 4, the result obtained for the virgin Au/Cr sample is plotted as a map of ω − 2θ scans in dependence of the tilt angle ψ (sample Au/Ti shows similar results).…”
Section: Resultsmentioning
confidence: 99%
“…These differences can be attributed to the crystal orientation. Previous studies show that radiation resistance of (100) crystal plane was strongest, (110) crystal plane took the second place, and (111) plane was the weakest [11,25]. Therefore, the He blisters which lids flaked off should occur on the (111) plane, and the partially cracked He blisters may take place on (110) crystal plane, and the no cracked He blisters occurred on (100) crystal plane.…”
Section: Inhibition Of Surface Blistering On W Followed By D Plasma E...mentioning
confidence: 95%
“…One is burst He blisters (as indicated by the red arrow), the second is high dome blisters with a large ratio of height and diameter (as indicated by the blue arrow), the third is small He blisters (as indicated by the yellow arrow). These may be caused by the difference of grain orientation, since the irradiation resistance of grains dependent on the grain orientation, resulting in the differences of surface blistering [11,25]. Figure 4(c) shows the microstructure under a blister lid.…”
Section: Surface Topography Of W Pre-implantation By Mass-separated H...mentioning
confidence: 99%
“…It has been indicated that the functional properties and structure performance of W in terms of particle irradiation resistance [8][9][10][11][12][13][14][15][16][17], surface morphology after irradiation [18][19][20][21], thermal conductivity [22] and fracture toughness [23] were related to its crystal orientation. Specifically, W grains with low crystallographic index displayed better irradiation resistance under deuterium plasma [8], helium neutral beam [9], helium/ hydrogen ions [10] and Ga + ion [11]. Surface morphology after irradiation was correlated with the normal direction of grain [19].…”
Section: Introductionmentioning
confidence: 99%