Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

Phansalkar, Sukrut Prashant; Kim, Changsu; Han, Bongtae

doi:10.1016/j.microrel.2022.114480

Cited by 22 publications

(4 citation statements)

References 49 publications

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“…Based on this principle, a series of higher temperatures are used to simulate accelerated tests, serving as a substitute for longer relaxation testing times [31]. The results of short-term relaxation tests at different temperatures are considered as part of a master curve shifted parallel to the logarithmic time axis [32]. Using 40 • C as the reference temperature, the bulk and shear relaxation modulus curves of specimens at different temperatures were horizontally shifted on the logarithmic time axis, ensuring that the curves were superimposed and seamlessly connected to each other, as illustrated in Figure 5.…”

Section: Relaxation Modulus Principal Curvesmentioning

confidence: 99%

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

Yang,

Ding,

et al. 2024

Polymers

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To describe the evolution of residual stresses in epoxy resin during the curing process, a more detailed characterization of its viscoelastic properties is necessary. In this study, we have devised a simplified apparatus for assessing the viscoelastic properties of epoxy resin. This apparatus employs a confining cylinder to restrict the circumferential and radial deformations of the material. Following the application of load by the testing machine, the epoxy resin sample gradually reduces the gap between its surface and the inner wall of the confining cylinder, ultimately achieving full contact and establishing a continuous interface. By recording the circumferential stress–strain on the outer surface of the confining cylinder, we can deduce the variations in material bulk and shear moduli with time. This characterization spans eight temperature points surrounding the glass transition temperature, revealing the bulk and shear relaxation moduli of the epoxy resin. Throughout the experiments, the epoxy resin’s viscoelastic response demonstrated a pronounced time-temperature dependency. Below the glass transition temperature, the stress relaxation response progressively accelerated with increasing temperature, while beyond the glass transition temperature, the stress relaxation time underwent a substantial reduction. By applying the time-temperature superposition principle, it is possible to construct the relaxation master curves for the bulk and shear moduli of the epoxy resin. By fitting the data, we can obtain expressions for the constitutive model describing the viscoelastic behavior of the epoxy resin. In order to validate the reliability of the test results, a uniaxial tensile relaxation test was conducted on the epoxy resin casting body. The results show good agreement between the obtained uniaxial relaxation modulus curves and those derived from the bulk and shear relaxation modulus equations, confirming the validity of both the device design and the testing methodology.

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Section: Relaxation Modulus Principal Curvesmentioning

confidence: 99%

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

Yang,

Ding,

et al. 2024

Polymers

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“…The CTE of packaging material is an important parameter in determining the reliability of electronic packaging, 7,9,10 and model‐based CTE modulation and optimization is indispensable for high‐end material design and application. So far, theoretical modeling and equations for predicting the CTE of particle‐reinforced composite have been extensively studied and discussed, several equations for predicting the CTE of composite have been reported 11–18 .…”

Section: Introductionmentioning

confidence: 99%

A mechanical model for predicting the thermal expansion behavior of spherical particle reinforced epoxy composites

Peng,

Zhang,

Fan

et al. 2024

Polymer Composites

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Modeling and theoretical prediction of thermal expansion property of particulate reinforced polymer composite are important hot issues in composite science and engineering. In this article, the thermomechanical interaction between spherical particle and polymer matrix and its contribution to the thermal expansion behavior of spherical particle reinforced polymer composite have been studied theoretically. A mechanical interphase resulted from the thermomechanical interaction is observed in radial distribution of effective coefficient of thermal expansion (CTE) around the particle with an isotropic assumption of the particle and polymer matrix, and with necessary simplification of the thermomechanical interference among particles, an analytical equation for predicting the CTE of the composite has been proposed. Compared with other models, good fits by this model with finite element (FE) simulated CTE value of particle reinforced composite and previously reported CTE data of particulate reinforced epoxy composites with particle size from micron to nanometer scale are observed. This study would deepen the understanding of the interphase in particle reinforced composites and be favorable for mechanism analysis of other physical properties of polymer composites.Highlights Thermomechanical interaction between spherical particle and matrix is studied A new model for the CTE of particle reinforced polymer composite is proposed FE simulation been carried out to examine the reasonability of the proposed model Present model well fits the reported reinforced epoxy composites CTE data A new perspective for analyzing other properties of reinforced composites

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“…In addition, the semiconductor package using a hot press requires significant operating costs and large space to use the equipment, which results in an increase in the overall cost of the packaging process. To overcome this problem, alternative manufacturing methods such as ovens and autoclaves have been introduced to replace the hot press process. − …”

Section: Introductionmentioning

confidence: 99%

Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements

Park

Kim

et al. 2023

ACS Appl. Mater. Interfaces

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Semiconductor packaging based on an epoxy molding compound (EMC) currently has several disadvantages including warpage, limited processing area, and variability that all negatively affect cost and production yield. We propose a facile EMC molding process method using a flash electro-thermal carbon fiber heating (FE-CH) device based on carbon fiber-based papers to manufacture an EMC molded to a copper substrate (EMC/Cu bi-layer package) via Joule heating, and using this device, a modified cure cycle that combines the conventional cure cycle (CCC) with rapid cooling was performed using FE-CH to reduce the curvature of the EMC/Cu bi-layer package. Compared to the conventional hot press process, which uses 3.17 MW of power, the FE-CH process only uses 32.87 kW, resulting in a power consumption reduction of over 100 times when following the CCC. Furthermore, the FE-CH-cured EMC/Cu bi-layer package exhibits mechanical properties equivalent to those of a hot press-cured specimen, including the degree of cure, elastic modulus, curvature, bonding temperature, residual strain, and peel strength. The modified cure cycle using the FE-CH results in a 31% reduction in residual strain, a 32% reduction in curvature, and a 47% increase in peel strength compared to the CCC, indicating that this new process method is very promising for reducing a semiconductor package’s price by reducing the process cost and warpage.

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Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

Cited by 22 publications

References 49 publications

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

A mechanical model for predicting the thermal expansion behavior of spherical particle reinforced epoxy composites

Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements

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