Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package

Depiver, Joshua A.; Mallik, Sabuj; Amalu, Emeka H.

doi:10.1016/j.microrel.2024.115415

Microelectronics Reliability

2024

DOI: 10.1016/j.microrel.2024.115415

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Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package

Joshua A. Depiver,

Sabuj Mallik,

Emeka H. Amalu

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2024

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Cited by 2 publications

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Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration

Saravanan,

Muthuram

2024

Mater. Res. Express

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Electronic packages are employed in diverse industries, including automotive, aerospace, and defense. However, their susceptibility to failure arises from exposure to uncontrolled operating conditions, particularly vibrations.Therefore, an investigation has been conducted to explore the effect of vibration in fatigue life of SAC305 lead free solder material employed in Printed Circuit Board (PCB) assembly with ball grid array (BGA) 144 electronic package. Finite Element Analysis (FEA) of a printed circuit board with BGA 144 electronic package was conducted to find their dynamic characterisics like natural frequencies and their mode shapes. Experiments were conducted to validate the numerically developed model, where first, second and third modes shapes from FEA and experimental results were compared. In addition, random vibration analysis was performed using numerical simulation where individual solder balls were analysed for stress distribution and experiments were conducted on specially fabricated PCBs using electro dynamic shaker for validation. Analysis shows that the failure was prominent at the solder balls located at the corner of the package. Further, Minor's rule was used to estimate the fatigue life of the Pb free solder material in BGA 144 package.

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Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration

Saravanan,

Muthuram

2024

Mater. Res. Express

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Experimental Evaluation of the Effectiveness of the Printed Circuit Board Strain-Based Methodology in Space-Borne Electronics with Vertically Mounted Printed Circuit Boards

Kim,

Park,

Park

et al. 2024

Aerospace

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The Oh-Park methodology was proposed to overcome the limitations of Steinberg’s theory for evaluating the structural safety of space-borne electronics and has been experimentally verified at the printed circuit board (PCB) specimen level for various types of electronic packages, such as ball grid arrays (BGAs), column grid arrays (CGAs), and small-outline packages (SOPs). However, it is necessary to validate the design methodology because the PCB mounted on the housing is affected by the elastic mode of the mechanical housing. In addition, although the validity of the existing theory based on critical strain has been verified for horizontally mounted structures, there are cases where PCBs are mounted vertically. Therefore, it is essential to consider the dynamic influence of the boundary conditions of mounted electronics. In this study, electronics specimens with corresponding boundary conditions were fabricated, and a fatigue-life test was performed. In addition, a structural analysis using Steinberg’s theory and the Oh-Park methodology was performed, and the results were compared with those of the fatigue-life test. The results showed that the analysis using the Oh-Park methodology accurately represented the test results, and the validity of the Oh-Park methodology for vertical electronics was verified experimentally.

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Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package

Cited by 2 publications

References 32 publications

Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration

Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration

Experimental Evaluation of the Effectiveness of the Printed Circuit Board Strain-Based Methodology in Space-Borne Electronics with Vertically Mounted Printed Circuit Boards

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