Effect of copper- and silver-based films on alumina substrate electrical properties

Reboun, Jan; Hlina, Jiri; Totzauer, Pavel; Hamáček, Aleš

doi:10.1016/j.ceramint.2017.11.107

Cited by 24 publications

(5 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Higher deflection is also caused by the more compact structure of silver films created by printing and firing the second silver layer, with fewer pores (comparison of SEM images of fired film with one and two silver layers in Figure 7 and Figure 8 ). In the case of paste C8717E, the deflection is enhanced by the more limited penetration of the glass phase into the substrate during the firing of the second layer [ 47 ]. The deflection of the two-layer specimens is higher for paste C8717E than for paste C1076SD, because the C8717E paste has larger grains, thus producing a more compact film with greater shrinkage during cooling after firing.…”

Section: Resultsmentioning

confidence: 99%

Study of Internal Stress in Conductive and Dielectric Thick Films

et al. 2022

Self Cite

View full text Add to dashboard Cite

This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and during cooling due to the differing coefficients of thermal expansion in fired film and ceramic substrates. Different thermal expansions cause deflection of the substrate and in extreme cases, the deflection can lead to damage of the substrate. Two silver pastes and two dielectric pastes, as well as their combinations, were used for the experiments, and the internal stress in the thick films was investigated using the cantilever method. Further experiments were also focused on internal stress changes during the experiment and on the influence of heat treatment (annealing) on internal stress. The results were correlated with the morphology of the fired thick films. The internal stress in the thick films was in the range of 8 to 21 MPa for metallic films and in the range from 12 to 16 MPa for dielectric films. It was verified that the cantilever method can be successfully used for the evaluation of internal stress in thick films. It was also found that the values of deflection and internal stress are not stable after firing, and they can change over time, mainly for metallic thick films.

show abstract

Section: Resultsmentioning

confidence: 99%

Study of Internal Stress in Conductive and Dielectric Thick Films

et al. 2022

Self Cite

View full text Add to dashboard Cite

show abstract

“…Thick film technology can be also utilized for the realization of power hybrid modules. Special copper pastes have recently been used for these applications, but the use of silver pastes is also possible for whole or parts of circuits [4]. These modules usually integrate a power and control section and are exposed to harsh conditions.…”

Section: Introductionmentioning

confidence: 99%

Testing of Electromigration Resistance of Copper and Silver Thick Films

Hlina,

Reboun,

Simonovsky

et al. 2024

IMAPSource Proceedings

View full text Add to dashboard Cite

This paper is focused on the electromigration resistance of copper and silver thick films. Electromigration was tested by water drop test. Four common conductive thick film pastes were used for testing – silver paste with low platinum content, and two silver pastes with different content of palladium and copper paste. Electromigration was tested under voltage of 6 and 12 V and time to shortcut was measured. Results of testing including the comparison of electromigration resistance depending on thick film paste type and different electrode spacing are described in this paper.

show abstract

“…High-temperature conductive silver paste is mainly composed of conductive metal, adhesive phase powder, and organic auxiliaries [17][18][19]. The conductive metal is the main component of the high-temperature conductive silver paste and determines the electrical conductivity.…”

Section: Introductionmentioning

confidence: 99%

The silver paste containing ZnO-B₂O₃-SiO₂ glass sintered at high temperature with low solid content formed high performance conductive thick film on MgTiO₃ microwave ceramics

Zhang

et al. 2023

Mater. Res. Express

View full text Add to dashboard Cite

A high-temperature conductive silver slurry containing lead-free ZnO-B2O3-SiO2 glass for metallization of ceramic MgTiO3 substrate has been prepared. The ZnO-B2O3-SiO2 glass was obtained by high-temperature melting and cold extraction with a transition temperature (Tg) of 579 ℃ and thermal stability (∆T) of 105 ℃ as an inorganic bonding phase of high-temperature conductive silver paste. Then, silver paste with different glass powder content was sintered on ceramic MgTiO3 substrate between 730 ℃ and 930 ℃ in increments of 50 ℃. Characterization of the prepared materials revealed that their resistivity increases with the increase in glass powder content and decreases with the increase in sintering temperature. Sintering temperature and glass content have significant effects on the resistivity and adhesion of the thick silver film. When the silver paste with a glass content of 1.1 wt% was sintered at 830 ℃ for 10 min, the resulting thick silver film had a low resistivity of 1.81 μΩ·cm (1.65 μΩ·cm for silver) and a good adhesive strength of 39.4 N/mm2. During the sintering process, the glass material melts and wets the silver powder, which promotes the sintering of the silver powder to form a dense network structure and improves the electrical conductivity of the silver film. In addition, the formation of ZnTiO3 by chemical reactions between the glass and the substrate was observed, which dramatically improved the bonding strength of the silver film. Therefore, lead-free silver paste containing ZnO-B2O3-SiO2 glass powder and MgTiO3 ceramics has broad development prospects in ceramic filters.

show abstract

Effect of copper- and silver-based films on alumina substrate electrical properties

Cited by 24 publications

References 6 publications

Study of Internal Stress in Conductive and Dielectric Thick Films

Study of Internal Stress in Conductive and Dielectric Thick Films

Testing of Electromigration Resistance of Copper and Silver Thick Films

The silver paste containing ZnO-B₂O₃-SiO₂ glass sintered at high temperature with low solid content formed high performance conductive thick film on MgTiO₃ microwave ceramics

Contact Info

Product

Resources

About

Effect of copper- and silver-based films on alumina substrate electrical properties

Cited by 24 publications

References 6 publications

Study of Internal Stress in Conductive and Dielectric Thick Films

Study of Internal Stress in Conductive and Dielectric Thick Films

Testing of Electromigration Resistance of Copper and Silver Thick Films

The silver paste containing ZnO-B2O3-SiO2 glass sintered at high temperature with low solid content formed high performance conductive thick film on MgTiO3 microwave ceramics

Contact Info

Product

Resources

About

The silver paste containing ZnO-B₂O₃-SiO₂ glass sintered at high temperature with low solid content formed high performance conductive thick film on MgTiO₃ microwave ceramics