Effect of Cooling Mode on Anodic Bonding Properties of Solid Polymer Electrolytes

Conductive polyurethane elastomer electrolyte (PUEE) materials for anodic bonding

“…[18][19][20] Furthermore, it has been recognized as a reliable and easy way to achieve rigid connections between electron-conductive materials and ion-conductive materials, of which the most reported materials are Si or metal bonded to borosilicate glass. 21,22 Because of the advantages of no joint ller requirement, low welding residual stress, excellent sealing and high connection strength, the proposed anodic bonding by applying a direct current (DC) potential and high temperature would form an intermediate bonding layer at the interfaces of different kinds of materials by electrochemical processes.…”

Synthesis and characterization of electrolyte substrate materials based on hyperbranched polyurethane elastomers for anodic bonding

“…It is observed from Figure 3(b) that the glass transition temperature ( T g ) values are shifted to the lower temperature with the increase of the content of PEO‐based electrolyte, which indicates that the movement of the chain segments are improved. This may be attributed to the decreased micro‐phase separation between the soft and the hard segments, which reduces the restriction of hard segments on motion of soft segments 34 . As shown in Figure 3(b), the T g s of all samples are below −40°C, indicating that the molecular chain segments of PEO‐HBPUEs have good flexibility, which can facilitate the migration of lithium ions and element diffusion during anodic bonding 35 …”

Effect of rare earth oxide CeO2 on the anodic bonding performance of PEG-based MEMS encapsulation materials

“…Figure 7 shows the current-time curves during the anodic bonding process (80°C, 800 V, 20 MPa). 16 At the beginning of the bonding process, the bonding current reached its peak value. As the bonding process progressed, the bonding current decreased slowly before plateauing at a minimum.…”