Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder

MacKay, C. A.; Voss, Wolfgang

doi:10.1179/026708385790087343

Cited by 9 publications

(4 citation statements)

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“…91,97). With the fluxes they used, MacKay and von VOSS 91 found that eutectic Sn-Bi wet Sn slightly better than either Pd or Cu surfaces, which were comparable.…”

Section: Solder-substrate Interactionsmentioning

confidence: 94%

“…The very low concentration of P (0·0002%) that causes wetting to degrade suggests that soldering on electroless Ni (which usually contains some phosphorus) could be problematic. MacKay and von VOSS 91 investigated the effect of contaminants on wetting of oxidised Cu and Sn-plated Cu between 166 and 220°C using a rosin mildly activated (RMA) and an OA flux. Wetting was affected by small amounts an Sb, As, Cu, Fe, Pb, Ni, and Pd.…”

Section: Solder-substrate Interactionsmentioning

confidence: 99%

“…20,47,91,[94][95][96]. Mei and Morris 47 measured the wetting angle for the eutectic Sn-Bi to be 35·4°± 2·0°(cf.…”

Section: Solder-substrate Interactionsmentioning

confidence: 99%

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Metallurgy of low temperature Pb-free solders for electronic assembly

Glazer¹

1995

International Materials Reviews

314

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Recent interest in Pb-free solders was stimulated by the introduction of (US) legislation that proposed the banning of Pb from a wide variety of uses, including electronic solders. Although there are solders that do not contain Pb, there is no obvious replacement for the eutectic and near eutectic Sn-Pb alloys that are in common industrial use today. This review surveys the literature on the metallurgy of Pb-free solders of interest for electronic assembly using organic substrates (solder liquidus temperatures between 100 and 232°C). This data (primarily on Sn-based binary eutectic alloys containing Ag, Bi, Cu, and In) provides a foundation for further study of both these alloys and more complex systems. The review is divided into three major sections: physical metallurgy (including physical properties and microstructure); mechanical properties (including tensile and shear behaviour, creep, and isothermal and thermal fatigue behaviour); and oxidation and corrosion behaviour.IMR/273

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“…91,97). With the fluxes they used, MacKay and von VOSS 91 found that eutectic Sn-Bi wet Sn slightly better than either Pd or Cu surfaces, which were comparable.…”

Section: Solder-substrate Interactionsmentioning

confidence: 94%

Section: Solder-substrate Interactionsmentioning

confidence: 99%

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Metallurgy of low temperature Pb-free solders for electronic assembly

Glazer¹

1995

International Materials Reviews

314

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“…In Japan, Sn58Bi solder is widely used in the industry and proposed as one of the most promising substitutes for lead solder. Because Sn58Bi solder has lower melting temperature around 139°C, good wettability, good yield strength and cost-efficiency [4].…”

Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

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Sn-Bi solder was proposed as one of the most promising substitutes for lead solder due to its lower melting temperature, good wettability, good yield strength and cost efficiency. With Ag elements added, the mechanical properties of Sn-Bi solder were improved obviously. There are two ways that are commonly used to add the reinforced particles into the solder. The first way (Way I) is to blend the reinforced particles with solder powders together, and then followed by pressure forming, sintering, cooling, crystallization and serious machining methods under inert atmosphere to make the solder paste. Another way (Way II) is to directly add the reinforced nano or micro particles into the solder paste by sufficient mechanical-stirring. In this research we would like to get fully understanding on the effects of these two ways of Ag addition on the mechanical properties of Sn-Bi-Ag solder joints during aging. Sn57.6Bi0.4Ag solder stands for the Way I and the doped Sn58Bi ? 0.4Ag solder stands for the Way II. These two kinds of joints were compared via micromorphology observation, thermal failure analyses as well as balls shear strength measurement after different aging time (under 100°C, from 0 to 800 h). The mechanical properties of Sn57.6Bi0.4Ag and the doped Sn58Bi ? 0.4Ag solder joints during aging were shown to be associated with the changes of micromorphology, the dissolution of IMCs, as well as the flatness of the joints' interface. Before long-time aging, the doped Sn58Bi ? 0.4Ag solder joints showed better mechanical performance than Sn57.6Bi0.4Ag solder joints. During aging, Sn56.7Bi0.4Ag solder joints had better performance in preventing the dissolution of Ni-Sn IMCs into the solder side, having smoother interfaces, comparing with Sn58Bi ? 0.4Ag solder joints. The degenerated phenomenon of Ag nanoparticle reinforcement seriously happened in the doped Sn58Bi ? 0.4Ag solder joints. After longtime aging, Sn57.6Bi0.4Ag solder joints had better mechanical properties than the doped Sn58Bi ? 0.4Ag solder joints.

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