Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Kim, Young-Sun; Kim, Keun Soo; Hwang, Chi-Jung; Suganuma, Katsuaki

doi:10.1016/s0925-8388(02)01168-4

Cited by 216 publications

(124 citation statements)

References 14 publications

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“…about 20-30 C for Sn-3Ag, Sn-0.7Cu, and Sn-Ag-Cu alloys. [15][16][17] These DSC results coincided with those expected for the binary phase diagrams of the alloys.…”

Section: Microstructures and Thermal Properties Of Alloyssupporting

confidence: 78%

Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder

et al. 2007

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The potential of newly-designed Zn-xSn (x ¼ 40, 30, and 20 mass%) and Zn-30 mass%In alloys as high temperature lead-free solders was evaluated, with particular focus on the fundamental thermal properties and phase stability during thermal and humidity exposure. From DSC results, the melting temperature of Zn-Sn alloys increased with decreasing Sn content, and the final undercooling was about 3 C. The liquid fraction of the alloys calculated using Scheil's model is lower than that of the alloys calculated according to the phase diagram by approximately 10 mass% at the eutectic temperature and 250 C. The coefficients of thermal expansion (CTE) of Zn-Sn alloys increased with decreasing Sn content, i.e. 29:2 Â 10 À6 ÁK À1 to 33:2 Â 10 À6 ÁK À1 in the temperature range of À50 C to 200 C for Zn-Sn alloys and 31:3 Â 10 À6 ÁK À1 in the temperature range of À50 C to 140 C for Zn-30In alloy. With increasing temperature above eutectic temperature, all alloys began to deform, indicating the formation of a liquid phase. The thermal deformation of Zn-Sn alloys decreased with increasing Sn content. The ultimate tensile strength (UTS) and 0.2% proof stress of the as-cast Zn-Sn alloys were almost the same, but the elongation of the as-cast Zn-Sn alloys decreased with increasing Sn content. After thermal and humidity exposure for 1000 h (85 C/85% Relative Humidity), only the outer surface of Zn-Sn alloys oxidized. However, Zn-30In alloy rusted quite seriously resulting in Zn oxidation after 1000 h. The UTS and 0.2% proof stress of Zn-Sn alloy slightly decreased with increasing exposure time. The elongation of Zn-Sn alloys decreased with decreasing Sn content for 100 h exposure. However, the elongation of Zn-Sn alloys showed no further degradation beyond 100 h exposure.

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“…about 20-30 C for Sn-3Ag, Sn-0.7Cu, and Sn-Ag-Cu alloys. [15][16][17] These DSC results coincided with those expected for the binary phase diagrams of the alloys.…”

Section: Microstructures and Thermal Properties Of Alloyssupporting

confidence: 78%

Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder

et al. 2007

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“…The cooling rate and Zn content affect the Zn morphology, IMC formation, its distribution throughout the bulk and, consequently, the final wettability and mechanical properties. [37][38][39] The model of dissolving Al by Sn was presented in Ref. 24, which shows the Al substrate dissolving in several steps.…”

Section: Resultsmentioning

confidence: 99%

Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate

Gancarz

Bobrowski

Pawlak

et al. 2017

Journal of Elec Materi

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Wetting of Al and Ni substrate by Sn-Zn eutectic-based alloys with 0.5 (wt.%) of Ga and 0.2 (wt.%) of Na was studied using the sessile drop method in the presence of ALU33 Ò flux. Spreading tests were performed for 60 s, 180 s, and 480 s of contact, at temperatures of 503 K, 523 K and 553 K (230°C, 250°C, and 280°C). After cleaning the flux residue from solidified samples, the spreading areas of Sn-Zn0.5Ga and Sn-Zn0.2Na on Al and Ni substrate were determined. Selected, solidified solder-pad couples were cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy, x-ray diffraction study and synchrotron measurements of the interfacial microstructure and identification of the phases. The growth of the intermetallic Ni 5 Zn 21 phase layer was studied at the solder/Ni substrate interface, and the kinetics of the formation and growth of the intermetallic layer were determined. The formation of interlayers was not observed on the Al pads. On the contrary, dissolution of the Al substrate and migration of Alrich particles into the bulk of the solder were observed.

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“…Moreover, Kim et al [6] found that with increasing of additional Bi content, the melting temperature decreased from 198.4˚C to 186.1˚C. However, the alloys with a high Bi content need to be controlled because of the brittle nature of Bi and the strong tendency for segregation [6] [14]. Chen and Li [15] reported that adding 1.0 wt.% Sb into Sn-Ag-Cu solder alloy could lower the activity of Sn by forming SnSb compound.…”

Section: Introductionmentioning

confidence: 99%

“…For example, the third element suggesting adding to Sn-9Zn eutectic alloy are Ag [4] [5], Bi [6] [7], In [8], Al [9] [10] and Ce/La [11] [12]. For instance, McCormack and Jin [8] found that small additions of 5% In can improve the ductility of Sn-Zn base solders.…”

Section: Introductionmentioning

confidence: 99%

“…It was found also that the wetting characteristics are improved when Ag is added [5] [13]. Moreover, Kim et al [6] found that with increasing of additional Bi content, the melting temperature decreased from 198.4˚C to 186.1˚C. However, the alloys with a high Bi content need to be controlled because of the brittle nature of Bi and the strong tendency for segregation [6] [14].…”

Section: Introductionmentioning

confidence: 99%

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Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

Eid¹,

Ramadan²,

Basaty³

2018

ENG

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The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130˚C. The stress exponent increases as the temperature drops from 100˚C to 50˚C, except for the 1.0% Sb alloy, where n 5.3 -6.1 at all the temperature range (T = 50˚C, 100˚C and 130˚C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.

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Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Cited by 216 publications

References 14 publications

Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder

Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder

Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate

Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

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