Effect of Complex Agent on Characteristics of Copper Conductive Pattern Formed by Ink-jet Printing

Lee, Young-In; Lee, Kun-Jae; Goo, Yong-Sung; Kim, Nam-Woo; Byun, Younghoon; Kim, Joong-Do; Yoo, Bongyoung; Choa, Yong‐Ho

doi:10.1143/jjap.49.086501

Cited by 35 publications

(37 citation statements)

References 17 publications

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“…a) XRD spectra of plasma‐converted metals with diffraction peaks indexed to the JCPDS database for Au (04‐0784), Pd (05‐0681), Ag (87‐0597), Pt (87‐0646), Cu (04‐0836), CuSO 4 (72‐0090), Bi (85‐1329), Pb (04‐0686), PbCl 2 (72‐1387), and Sn (20‐1293). Comparison of resistivity and process temperature of printed and plasma‐converted b) Au and c) Cu films with literature values for nanoparticle (NP) and MOD‐based inks …”

Section: Resultsmentioning

confidence: 97%

A New Class of Low‐Temperature Plasma‐Activated, Inorganic Salt‐Based Particle‐Free Inks for Inkjet Printing Metals

Sui

Dai

Liu

et al. 2019

Adv Materials Technologies

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tailor the properties of the printed device for each specific application.Currently, printing approaches such as inkjet printing have been limited to a small number of metals because of the inks that are composed of either nano particles or metal-organics. Metal nano particlebased inks are characterized by high metal loading which lead to low contact resistances. However, the inks are prone to agglomeration because of the high particle densities and the high sur face free energy of nanoparticles. For this reason, a number of steps are required to synthesize dispersed and printable inks, including the addition of organic capping groups such as poly(Nvinyl 2pyrrolidone) to sterically stabilize the particles. [9] The interactions between the organics and the metal nanoparticle surface are material specific and most studies have focused on Ag, [10] Au, [11] and Cu. [12] Alternatively, metalloorganic decomposition (MOD) inks composed of molecular metal-organic compounds are particlefree, reducing nozzle clogging, and free of the organic capping groups. [13] A drawback, though, is that these compounds are not readily available and must be carefully designed and syn thesized so that they are stable before and during printing near ambient temperatures, while still capable of being decomposed to produce metallic structures at slightly elevated temperatures. [14] Overall, MOD has focused on Ag, with an increasing number of studies only recently emerging on other metals such as Cu. [12] In addition to the limited number of metals, printing has also been restricted to a few substrates that can withstand relatively high temperatures because of a heating step, referred to gener ally as sintering, that is carried out after printing. In the case of metal nanoparticlebased inks, heating is required to remove the organic capping groups and fuse the metal nanoparticles to form percolating electrically conductive structures. [15] For MOD inks, the heating activates decomposition of the metal-organic compound which leads to release of the organic groups and metal nanoparticle nucleation and growth. [16] Recently, alter native approaches to heating such as chemical, [17] electrical, [18] photonic, [10,19] laser, [20] plasma, [21] and microwave [15,22] have been reported to lower the thermal loading; however, the effec tiveness of these methods varies considerably. [23] Inkjet printing is rapidly emerging as a means to fabricate low-cost electronic devices; however, its widespread adoption is hindered by the complexity of the inks and the relatively high processing temperatures, limiting it to only a few metals and substrates. A new approach for inkjet printing is described, based on commercially available, particle-free inks formulated from inorganic metal salts and their subsequent low-temperature conversion to metallic structures by a non-equilibrium, inert gas plasma. This single, general method is demonstrated for a library of metals including gold (Au), silver (Ag), copper (Cu), palladium (Pd), platinum (Pt), lead (Pb), bismut...

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Section: Resultsmentioning

confidence: 97%

A New Class of Low‐Temperature Plasma‐Activated, Inorganic Salt‐Based Particle‐Free Inks for Inkjet Printing Metals

Sui

Dai

Liu

et al. 2019

Adv Materials Technologies

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“…In addition, there have been studies for the development of copper paste or ink, which do not require inert atmosphere and lower temperature, but they still have challenges to overcome [80][81][82][83].…”

Section: Coating Of Copper Powder With Cobalt-catalyzed Carbon Nanofimentioning

confidence: 99%

Conductive Copper Paste for Crystalline Silicon Solar Cells

Lee¹,

Lee²

2019

Recent Developments in Photovoltaic Materials and Devices

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In photovoltaic industries, the main technique of metallization is screen printing with silver pastes due to its simple and quick process. However, the expensive price of silver paste is one of the barriers to the production of low-cost solar cells. Therefore, the most focused target in photovoltaic research is the decreasing consumption of silver paste or substitute silver for other materials. As a proper candidate, copper has been researched by many institutes and companies since it has a similar conductivity with silver even though the price is inexpensive. To apply copper as a contact for solar cells, the plating technique has been actively researched. However, copper paste, which was mainly developed for integrated circuit applications, has been recently researched. Mostly, copper paste was developed for the low-temperature annealing process since copper tends to oxidize easily. On the other hand, firing type copper paste was also developed by coating copper particles with a barrier layer. This chapter discusses recent development of copper paste for the application of solar cells and its appropriate annealing conditions for better electrical properties. Also, the light I-V characteristics of copper paste on the solar cells in other research papers are summarized as well.

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“…6,7 To overcome this problem of easy oxidation, Cu based metalorganic decomposition (MOD) inks have also been studied. [8][9][10] MOD inks consist of metalorganic compounds, solvents, and some other additives. These types of inks have their Cu source in a monovalent or divalent state in the metalorganic compounds, so there is no possibility of the formation of undesired Cu oxide or precipitation of the metal source during storage.…”

Section: -5mentioning

confidence: 99%

Electrical behavior of laser-sintered Cu based metal-organic decomposition ink in air environment and application as current collectors in supercapacitor

Rho

Kang

et al. 2015

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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Cu based metal-organic decomposition (MOD) ink has been preferred as a printable conductive material in the field of printed electronics because it can mitigate the formation of undesired Cu oxide or precipitation of the metal source during storage and printing. However there will be oxidation of Cu during sintering process in air environment, for fabrication of conductive track from printed ink. In this paper, possibility of laser-sintering of Cu MOD ink in air was studied. The Cu MOD ink was spin-coated on polyimide (PI) substrate. The laser with 355 nm wavelength was accommodated as a heat source in this study. The parametric study with various laser power intensities and scan rates, showed 230-557 W/cm 2 and 1-8 mm/s as the feasible laser-sintering process window. As a result, the specific resistance of the laser-sintered Cu MOD ink was achieved 21 µΩcm which was about 10 times as much as that of bulk Cu. As an application, laser-sintered Cu MOD ink was confirmed to give acceptable performances compared to traditional Cu sheet electrodes as flexible current collectors of the supercapacitor.

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Effect of Complex Agent on Characteristics of Copper Conductive Pattern Formed by Ink-jet Printing

Cited by 35 publications

References 17 publications

A New Class of Low‐Temperature Plasma‐Activated, Inorganic Salt‐Based Particle‐Free Inks for Inkjet Printing Metals

A New Class of Low‐Temperature Plasma‐Activated, Inorganic Salt‐Based Particle‐Free Inks for Inkjet Printing Metals

Conductive Copper Paste for Crystalline Silicon Solar Cells

Electrical behavior of laser-sintered Cu based metal-organic decomposition ink in air environment and application as current collectors in supercapacitor

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