2011
DOI: 10.1016/j.compscitech.2011.06.012
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Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy

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Cited by 176 publications
(52 citation statements)
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“…(ii) using multimodal diamond particle mixtures to increase the diamond content in the composite [5][6][7]; or (iii) engineering the matrix-diamond interface, either by forming a new reaction layer during processing [8][9][10][11] or using diamond particles previously treated with different coatings [12][13][14][15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…(ii) using multimodal diamond particle mixtures to increase the diamond content in the composite [5][6][7]; or (iii) engineering the matrix-diamond interface, either by forming a new reaction layer during processing [8][9][10][11] or using diamond particles previously treated with different coatings [12][13][14][15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%
“…Two strategies were used. First, a surface coating of nano-dimensioned TiC was applied to the diamond particles (TiC coatings have been proven to enhance the metal-diamond interface thermal conductance for metals such as Al [12,13] and Cu [14][15][16]). Second, at the micro-/meso-scale, a proper design route based on blending different predictive models was used to select the most adequate combinations of bimodal diamond particle mixtures.…”
Section: Introductionmentioning
confidence: 99%
“…Many investigations have been made on the diamond/metal composites family, which exhibits high performance with TC ranging from 350 Wm -1 K -1 to 700 Wm -1 K -1 [3]. However, the high price and the poor machinability limit their wide application.…”
Section: Introductionmentioning
confidence: 99%
“…Thus, the fabrications of highly thermal conductive material such as metal-matrix composites are exhaustively studied for this emerging demand. 3,4 Thermal conductivities above 20W/cmK and coefficients of thermal expansion of the order of 4-6 ×10 -6 1/K are used in conventional heat spreader materials. 5 Due to its high thermal conductivity, 6 chemical and mechanical stability, 7 low dielectric constant and high dielectric strength, 8 diamond films are one of the best candidates for thermal spreading device fabrication applications.…”
Section: Introductionmentioning
confidence: 99%
“…The utilization of diamond for thermal management application is mainly carried out in two ways: CVD coating and diamond-based metal matrix composites (MMCs) such as diamond/Cu, diamond/Al and diamond/Ag, etc, 5,9-13 Moreover, diamond-silicon carbide composites are also produced under high pressure, high temperature conditions. 14 On the other hand, diamond/β-SiC composite films exhibiting a gradient composition were synthesized by a hot filament CVD technique utilizing H 2 , CH 4 , and tetramethylsilane as reaction gases. 15 The effect of copper on the thermal management efficiency of diamond for heat sink applications is reported.…”
Section: Introductionmentioning
confidence: 99%