Effect of Chloride Ions on Electrochemical Behavior of Canister Materials

Kim, Gha-Young; Jang, Junhyuk; Lee, Min-soo; Kim, Jin-Seop

doi:10.1155/2022/8577144

Cited by 3 publications

(2 citation statements)

References 24 publications

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“…A two-step increase in the anodic current (Cu → Cu + → Cu 2+ ) was observed above E corr , as reported in the literature [17]. In the chloride-added groundwater solution, E corr declined to − 0.163 V vs. SCE, and I corr increased signi cantly to 5.214 µA/cm 2 , indicating the corrosive in uence of chloride ions [19][20][21]. Notably, an apparent maximum peak followed by a reduction in the current density, succeeded by a limiting current-density response, occurred at approximately 0.08 V vs. SCE.…”

Section: Resultssupporting

confidence: 68%

Electrochemical characterization of Cu film fabricated via wire arc additive manufacturing in oxic groundwater

Kim,

Jang,

Woo

et al. 2024

Preprint

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We investigated the electrochemical corrosion behavior of Cu films fabricated using wire arc additive manufacturing (WAAM) as a candidate canister material for deep geological disposal (DGD). The investigation was conducted in an oxic groundwater solution. The initial corrosion potential and corrosion current density of the WAAM-Cu film obtained from potentiodynamic measurements were similar to those of conventionally fabricated Cu (forged Cu) in oxic groundwater, regardless of the addition of chloride ions. To investigate the long-term corrosion behavior, WAAM-Cu was immersed in a chloride-added oxic groundwater environment for 120 d, and open-circuit potential and electrochemical impedance spectroscopy measurements were performed at specific time intervals. The total polarization resistance of the WAAM-Cu was lower than that of the forged Cu; this was possibly due to the difference in the structural properties of the copper oxide layer formed on the surface. Surface analysis revealed that general corrosion occurred on the WAAM-Cu; however, the surface roughness was higher than that of forged Cu. Moreover, delamination of the corroded layer of the WAAM-Cu was observed. To ensure corrosion resistance and long-term stability in the context of DGD repository conditions, further research is necessary to optimize the WAAM technique for the fabrication of Cu films.

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Section: Resultssupporting

confidence: 68%

Electrochemical characterization of Cu film fabricated via wire arc additive manufacturing in oxic groundwater

Kim,

Jang,

Woo

et al. 2024

Preprint

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“…Tus, the obtained value in this study can be used for relative comparison depending on the test materials or the experimental conditions. Given that chloride ions are one of the main factors afecting the corrosion thickness of metal canisters [14], the mass changes of test metals were also investigated in oxic groundwater solutions with the addition of 0.1 M NaCl. Figure 3 shows the OCP (solid line) and mass change (dashed line) of the test metals immersed in 0.1 M NaCladded oxic groundwater.…”

Section: Resultsmentioning

confidence: 99%

Investigation of Early Corrosion Behavior of Canister Candidate Materials in Oxic Groundwater by the EQCM Method

Kim

Jang

et al. 2022

Science and Technology of Nuclear Installations

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This study investigated the corrosion mass changes of canister candidate materials (Cu, Ni, Ti, SS304) in an oxic groundwater solution using the electrochemical quartz crystal microbalance method in order to estimate corrosion thickness. The materials were immersed in naturally aerated groundwater with and without the addition of chloride ions to observe the mass changes as well as the open-circuit potential (corrosion potential). In the oxic groundwater solution, Ni, Ti, and SS304 exhibited negligible mass changes, indicating their insusceptibility to general corrosion. In contrast, the Cu electrode exhibited a relatively significant mass change (63.8 ng/cm2 for 60 h), and the maximum corrosion thickness was estimated to be approximately 0.1 μm/yr. In the presence of chloride ions, the Ni and Ti electrodes did not reveal demonstrate any significant changes, whereas the SS304 electrode was slightly increased compared to an absence of chloride ions. A lower mass change occurred when the Cu electrode was immersed in the chloride-containing groundwater solution compared with the absence of chlorides because the dissolution of Cu as CuCl 2 − was involved in Cu2O formation.

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Electrochemical corrosion behavior of atmospheric-plasma-sprayed copper as a coating material for deep geological disposal canisters

Kim

Lee

et al. 2023

Nuclear Engineering and Technology

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Effect of Chloride Ions on Electrochemical Behavior of Canister Materials

Cited by 3 publications

References 24 publications

Electrochemical characterization of Cu film fabricated via wire arc additive manufacturing in oxic groundwater

Electrochemical characterization of Cu film fabricated via wire arc additive manufacturing in oxic groundwater

Investigation of Early Corrosion Behavior of Canister Candidate Materials in Oxic Groundwater by the EQCM Method

Electrochemical corrosion behavior of atmospheric-plasma-sprayed copper as a coating material for deep geological disposal canisters

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