Effect of Chain Flexibility of Epoxy Encapsulants on the Performance and Reliability of Light-Emitting Diodes

Chen, Zhuo; Liu, Zhuoyu; Shen, Guohua; Wen, Ruiheng; Lv, Jie; Huo, Jizhen; Yu, Yingfeng

doi:10.1021/acs.iecr.6b01159

Cited by 19 publications

(18 citation statements)

References 46 publications

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“…Figure shows the predicted CLTE of the epoxy as a function of crosslink density at 300 K. A range of experimental CLTE values from the literature (with unknown crosslink density) are included in the plot. The plot demonstrates that the predicted CLTE decreases with increasing crosslink density.…”

Section: Resultsmentioning

confidence: 99%

“…The predicted glasstransition temperatures for 85% and 90% crosslink densities are in good agreement with the experiment, for which the crosslink density is not known precisely, but are typically in the range of 90% for most epoxies. Figure 15 shows the predicted CLTE of the epoxy as a function of crosslink density at 300 K. A range of experimental CLTE values from the literature [42][43][44][45][46] (with unknown crosslink density) are included in the plot. The plot demonstrates that the predicted CLTE decreases with increasing crosslink density.…”

Section: Resultsmentioning

confidence: 99%

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Multiscale thermal modeling of cured cycloaliphatic epoxy/carbon fiber composites

Chinkanjanarot

Radue

Gowtham

et al. 2018

J of Applied Polymer Sci

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Cycloaliphatic epoxies (CEs) are commonly used for structural applications requiring improved resistance to elevated temperatures, UV radiation, and moisture relative to other epoxy materials. Accurate and efficient computational models can greatly facilitate the development of CE‐based composite materials for applications such as Aluminum Conductor Composite Core high‐voltage power lines. In this study, a new multiscale modeling method is developed for CE resins and composite materials to efficiently predict thermal properties (glass‐transition temperature, thermal expansion coefficient, and thermal conductivity). The predictions are compared to experimental data, and the results indicate that the multiscale modeling method can accurately predict thermal properties for CE‐based materials. For 85% crosslink densities, the predicted glass‐transition temperature, thermal expansion coefficient, and thermal conductivity are 279 °C, 109 ppm °C−1, 0.24 W m−1 K−1, respectively. Thus, this multiscale modeling method can be used for the future development of improved CE composite materials for thermal applications. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46371.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Multiscale thermal modeling of cured cycloaliphatic epoxy/carbon fiber composites

Chinkanjanarot

Radue

Gowtham

et al. 2018

J of Applied Polymer Sci

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“…Epoxy-based materials, especially one component fast curing systems, with their good dielectric behavior, are widely applied in microelectronic packaging areas, 1 –6 which require high thermal mechanical performance as well as high stability during hydrothermal aging and/or in corrosion environment.…”

Section: Introductionmentioning

confidence: 99%

Corrosion protection and thermal and mechanical properties for epoxy–thiol–imidazole systems of improved performance

Xing

Gao

Zhang

et al. 2019

High Performance Polymers

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Epoxy–thiol–imidazole system is promising for microelectronic packaging areas, such as underfills and low-temperature fast curing adhesives, but there is little knowledge on the corrosion resistance of this system. In this article, the anticorrosion and thermal and mechanical properties were characterized by theoretical and experimental methods and were understood from a fundamental perspective of structure. The cure behaviors were evaluated by differential scanning calorimeter. The mechanical and thermal properties were characterized by dynamic mechanical, thermomechanical, and thermos-gravimetric methods. The water absorption process was monitored using gravimetric measurement. Results show that among compositions of variable thiol–epoxy molar ratios, the one with ratio 0.25 has the best anticorrosion property and improved mechanical property, as well as good water resistance at room temperature. Both the average tensile strength and modulus increased initially and then declined with the addition of thiol part, while the average peel strength increased to above thrice the value of that of neat epoxy–imidazole system for thiol–epoxy 1:1 system.

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“…As a frame material, epoxy is widely used as encapsulant due to its good adhesion, strong mechanical strength and rapid curing processing, but is still limited by poor moisture resistance, weak thermal stability, and a low refractive index [ 3 , 4 , 5 , 6 , 7 ]. On the contrary, organosilicone resin possesses a relatively high refractive index, strong moisture resistance, and good thermal stability, as well as good compatibility with glass substrate [ 8 , 9 , 10 , 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Quartz Microcrystal-Hybridized Organosilicone Encapsulant with Enhanced Optical and Thermal Performances

et al. 2018

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Encapsulant is one determining factor underpinning the device lifetimes of organic optoelectronics. However, encapsulant seriously needs improvement in optical, thermal, and mechanical properties, especially to develop organic light emitting diodes. In this study, we prepared an in situ crosslinked organosilane composite containing benzyloxy and glycidyl-modified quartz microcrystal (mQMC) as high performance encapsulant. In the present work, methylphenylsilanediol (MPSD) was introduced as a novel crosslinker to impart appropriate structural strength. Along with increasing mQMC fillers, this organosilane system shows improved properties, such as refractive index, thermal stability, and storage modulus. Specifically, these hybridized mQMCs in the organosilane framework may facilitate an approximate two-fold increase (0.238 W/(m·K)) in overall thermal conductivity at the determined concentration.

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Effect of Chain Flexibility of Epoxy Encapsulants on the Performance and Reliability of Light-Emitting Diodes

Cited by 19 publications

References 46 publications

Multiscale thermal modeling of cured cycloaliphatic epoxy/carbon fiber composites

Multiscale thermal modeling of cured cycloaliphatic epoxy/carbon fiber composites

Corrosion protection and thermal and mechanical properties for epoxy–thiol–imidazole systems of improved performance

Quartz Microcrystal-Hybridized Organosilicone Encapsulant with Enhanced Optical and Thermal Performances

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