Effect of CeSi2 addition on microstructures of brazed layers and interfacial characteristics of brazed diamonds with Ni Cr filler alloy

Li, Xin; Zhang, Jian; Xu, Qi; Zhang, Mingjun; Zhang, Zhihao; Zhang, Ao; Peng, Ping

doi:10.1016/j.diamond.2022.109486

Cited by 7 publications

(2 citation statements)

References 45 publications

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“…This result is also consistent with the increasing Cr content from the interface to the end of the reaction layer, according to the EDS line scan result given in Figure 7A. In previous studies using NiCr‐based filler to braze diamonds, it was generally observed that only Cr 3 C 2 was generated at the interface 31,32 . Cr 7 C 3 was rarely observed but it was believed to possess higher abrasion resistance and higher hardness than those of Cr 3 C 2 33 .…”

Section: Resultssupporting

confidence: 87%

“…In previous studies using NiCr-based filler to braze diamonds, it was generally observed that only Cr 3 C 2 was generated at the interface. 31,32 Cr 7 C 3 was rarely observed but it was believed to possess higher abrasion resistance and higher hardness than those of Cr 3 C 2 . 33 The results indicate that the HEA filler reacted more sufficiently with diamond, which is beneficial to improve the bonding strength and wear resistance of the brazed diamond.…”

Section: Wetting Behavior and Interfacial Microstructure Characteriza...mentioning

confidence: 99%

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Diamonds brazing with a novel Cu₃₅Ni₃₅Cr₁₀Fe₁₀Sn₁₀ high‐entropy alloy filler

Wei,

Zhang,

et al. 2024

J Am Ceram Soc.

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A novel Cu35Ni35Cr10Fe10Sn10 high‐entropy alloy (HEA) filler with a relatively low melting point (935°C) was designed for brazing diamonds, and its technical advantages over conventional NiCr‐based fillers, that is, favorable wettability, high bonding strength, low thermal damage, and high mechanical performance, were convincingly demonstrated. The newly developed HEA filler had a contact angle of only 11° on the graphite (energetically close to diamond) surface and it could braze diamonds at 1000°C, much lower than the brazing temperature of conventional NiCr‐based fillers. Consequently, the brazed diamond exhibited greatly decreased surface thermal damage, higher fracture strength, and better wear performance. The solidified microstructure of the HEA filler contained three solid solution phases, that is, FeCrNi‐rich, CuNi‐rich, and CuSnNi‐rich phases that were formed through the liquid phase separation process, plus a minor phase of nanosized FeCr‐rich precipitates. The reaction products at the HEA filler/diamond interface were simply an inner Cr3C2 layer and an outer Cr7C3 layer, without other complex brittle compounds that are commonly seen in NiCr‐based fillers after diamond brazing. Apparently, the HEA filler reacted more sufficiently with diamonds, which contributed to improve the bonding strength and wear resistance of the brazed diamond. This work provided a new application scenario for HEAs as promising filler materials for brazing diamonds.

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Section: Resultssupporting

confidence: 87%