Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration

Jeong, Hyunsik; Seo, Kwangwon; Bae, Jinsoo; Jang, Gunhee

doi:10.1007/s00542-023-05532-8

Cited by 3 publications

(4 citation statements)

References 25 publications

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“…Figure 5 shows the natural frequencies and mode shapes. The damping ratio of the BLR test board was set to 2%, which was derived from the measured frequency response function through modal experiments by Jeong et al [9]. Figure 6 shows the applied power spectral density (PSD) profile.…”

Section: Random Vibration Analysismentioning

confidence: 99%

“…Recently, many studies have been conducted on the changing mechanical design of PCB and the boundary conditions that improve the fatigue life of solder joints [8][9][10]. Doranga et al [8] compared the fatigue life of solder joints with different PCB thicknesses under vibration loading.…”

Section: Introductionmentioning

confidence: 99%

“…As a result, the stress on the solder joint decreases and the fatigue life increases. Jeong et al [9] investigated the effect of the fastening area of a board with mounted packages on the fatigue life of solder joints under random vibration. They found that the stiffness of the board increases as the fastening area increases, resulting in increased solder joint lifetime.…”

Section: Introductionmentioning

confidence: 99%

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Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration

Lee,

Jeong,

Jang

2024

Materials

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We investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stress, which are the main parameters influencing the fatigue life of solder joints under thermal cycling and random vibration, respectively. We analyzed the correlation between the screw hole position and the main parameters of the fatigue life through sensitivity analysis. By performing multi-objective optimization, we determined the screw hole position that maximizes the fatigue life of solder joints under thermal cycling and random vibration. With the optimal screw hole position, the fatigue life significantly increased under thermal cycling and random vibration compared to the BLR test board with the initial screw hole position.

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Section: Random Vibration Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration

Lee,

Jeong,

Jang

2024

Materials

Self Cite

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“…Hamdani et al (Hamdani et al, 2022) have studied the lifetime of mechatronic packaging using FEM method, Darvaux model and metamodels; metamodels were used to assess the reliability of the package. (Jeong et al, 2023) have studied the effect of boundary conditions on fatigue life of BGA solder joints at board with mounted packages level under random vibration. (Surendar et al, 2019) have studied the effects of drop impact in the thermal cycling on creep-fatigue failure of SAC solder joints in BGA packages.…”

Section: Introductionmentioning

confidence: 99%

Hybrid model of the FEM method and the SAR algorithm to perform reliability-based design optimization of the solder joints in the BGA assembly

Reddad,

Zemzami,

Hami

et al. 2024

Preprint

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Metaheuristic optimization algorithms are powerful for solving complex optimization problems, almost when we lack information about the nature of their objective function. Meanwhile, the Finite Element Method (FEM) is a very powerful method for predicting and simulating the behavior of systems subjected to various stresses, whether electrical, thermal, mechanical, vibratory or magnetic. In the current study, we have proposed an optimization methodology that couples a metaheuristic algorithm - the Search and Rescue Algorithm (SAR) - with the finite element method. We then investigated the proposed methodology for optimizing the reliability of solder balls with respect to their geometry in a Ball Grid Array (BGA) assembly subjected to thermal cycling load. First, we performed a sensitivity analysis to determine the parameters influencing solder ball reliability, then we optimized the plastic deformation of solder balls, hence increasing their reliability as a function of their geometry through the proposed methodology, which results in improving the reliability of the entire electronic component.

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Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration

Saravanan,

Muthuram

2024

Mater. Res. Express

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Electronic packages are employed in diverse industries, including automotive, aerospace, and defense. However, their susceptibility to failure arises from exposure to uncontrolled operating conditions, particularly vibrations.Therefore, an investigation has been conducted to explore the effect of vibration in fatigue life of SAC305 lead free solder material employed in Printed Circuit Board (PCB) assembly with ball grid array (BGA) 144 electronic package. Finite Element Analysis (FEA) of a printed circuit board with BGA 144 electronic package was conducted to find their dynamic characterisics like natural frequencies and their mode shapes. Experiments were conducted to validate the numerically developed model, where first, second and third modes shapes from FEA and experimental results were compared. In addition, random vibration analysis was performed using numerical simulation where individual solder balls were analysed for stress distribution and experiments were conducted on specially fabricated PCBs using electro dynamic shaker for validation. Analysis shows that the failure was prominent at the solder balls located at the corner of the package. Further, Minor's rule was used to estimate the fatigue life of the Pb free solder material in BGA 144 package.

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Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration

Cited by 3 publications

References 25 publications

Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration

Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration

Hybrid model of the FEM method and the SAR algorithm to perform reliability-based design optimization of the solder joints in the BGA assembly

Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration

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