Effect of Bonding Conditions on Al/Cu Dissimilar Bonding with Liquefaction by Reaction Diffusion in Air

Abstract

The possibility and the mechanical properties of Al/Cu dissimilar bonding with liquefaction by the reaction diffusion in air were investigated at the temperature range between the melting point of aluminum and the eutectic temperature of Al-Cu system equilibrium diagram. The surface of each specimen was prepared by a simple preprocessing with the polishing and the cleaning by acetone. The Al/Cu dissimilar joint could be obtained by this bonding process in air. The bonding pressure is an important factor for this bonding process. The increment of bonding temperature and the decrement of oxygen concentration of air also promote solid state diffusion at Al/Cu interface. All bonded specimens in this study were fractured by the brittle fracture mode like cleavage fracture. The phases observed mainly in fracture surface is θ phase. The tensile strength of specimen bonded in air is similar with that of specimen by the diffusion bonding in vacuum.

Effect of Heating Rate on Al Bonding in Air by Inserted A5056 Disk

“…The authors investigated also the behavior of Mg in Al-2.5Mg/Cu bond. Characteristic microstructure including Al and Mg oxide film was observed in the bond [7]. Chemical reaction, for example, the growth of oxide film depends on heating temperature and time.…”

“…However, excess Mg content decreased tensile strength [5]. Al/Cu dissimilar bonding in air was investigated by the unique technique composes of the liquefaction of the bonding surface by the reaction diffusion [6]. This bonding technique needs higher bonding temperature than diffusion bonding, but it saves bonding time.…”