Effect of Bias Voltage on the Electrochemical Migration Behaviors of Sn and Pb

In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field

“…As another key factor in ECM behaviors of materials, solution chemistry, such as the concentration of the aggressive ions, 11,12,17 the species categories including chloride ions, 2,11,16,17,19 bromide ions, 2 adipic acid, 2 sulfate ions, 19,20 dusty, 2 are also strongly concerned by many researchers. Electric field, the basic driving force for ECM, has also been reported in recent publications, [2][3][4][5]13,14 and a common conclusion is that higher electric field leads to faster ions migration rate.…”

“…On the one hand, precipitates Sn(OH) 4 and Sn(OH) 2 will be formed when OH − meets with Sn 4+ or Sn 2+ during their migration processes, respectively. This can be ascribed to their very low solubility product constants: K sp (Sn(OH) 4 ) = 10 −57 and K sp (Sn(OH) 2 ) = 5.45 × 10 −27 at 298.15 K. 23,24 On the other hand, the hydrolysis of Sn 4+ (reaction 8) and direct oxidation of tin to Sn(OH) 4 (reaction 9) will also contribute part of the total amount of precipitates.…”

“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] In this work, two-electrode-system was also employed to detect the failure time of circuits and in situ observe the ECM development (See Figure 1). …”

“…The first one is the droplet test (sometimes called water drop test), which can be performed rapidly and is suitable for quantitative investigations. [1][2][3][4][5][6] The second one is the simulated environment experiment (such as thermal humidity bias test (THB) and highly accelerated stress test (HAST)). [7][8][9][10] This method is the most practical way because it can well simulate the environmental conditions that the electronic devices are in service.…”

“…The ECM behaviors of Sn and its alloys have attracted considerable attentions due to their significant roles as conducting or welding materials in electronic devices. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] Each material has its own migration characteristic and mechanism. As another key factor in ECM behaviors of materials, solution chemistry, such as the concentration of the aggressive ions, 11,12,17 the species categories including chloride ions, 2,11,16,17,19 bromide ions, 2 adipic acid, 2 sulfate ions, 19,20 dusty, 2 are also strongly concerned by many researchers.…”