Effect of autoclave test on anisotropic conductive joints

Tan, C.W.; Chan, Y.C.; Yeung, N.H.

doi:10.1016/s0026-2714(02)00293-7

Cited by 29 publications

(9 citation statements)

References 5 publications

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“…The existence of oxygen shows that there is an oxide layer formed at the Cu surfaces after 384 h. Oxidation weakens the strength of the joint as described earlier. 13 Humid test conditions also caused hydrolysis at the ACF outer surface as observed in Fig. 12.…”

Section: B Mechanical Shock Of Humidified Samplementioning

confidence: 85%

“…One of the most common is the debonding of the chip from the ACF. Previous studies 13 showed that an ACF is very sensitive to moisture and prone to swelling that leads to shrinkage in the contact area and fracture at the bonding interface. Water molecules can diffuse into the adhesive matrix and further oxidize or hydrate the metal surface thus reducing the electrical and mechanical performance of the joint.…”

Section: A Mechanical Shockmentioning

confidence: 99%

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Effect of drop impact energy on contact resistance of anisotropic conductive adhesive film joints

2004

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The contact resistances investigated in this study of anisotropic conductive adhesive film joints using Au/Ni bumps and flexible substrates are found to be increased by the drop impact energy and also by the combined effect of heat/humidity and the impact energy. The samples humidified at 85 °C/85% RH for 384 h, on which impact energy of 50 J was induced, exhibit the most severe results. The contact resistance increases by 700%, which had been about 0.062 Ω in the as-bonded condition. The samples without humidification showed a sluggish and gentle increase in contact resistance with induced drop impact energy. The contact resistance was found to be increased by 400% after absorbing 90 J energy. Scanning electron microscopy images show particle deformation due to abrasion and friction between the contacting surfaces resulting from the sudden impact. Joints are also observed with no connections, which signify open circuits. Almost 25% of circuits were found open in the samples (after 384 h in a humid environment), which have suffered severe mechanical shock. Breaking of the conductive layer of the particle and exposing the underlying polymeric portion was also observed.

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Section: B Mechanical Shock Of Humidified Samplementioning

confidence: 85%

Section: A Mechanical Shockmentioning

confidence: 99%

Effect of drop impact energy on contact resistance of anisotropic conductive adhesive film joints

2004

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“…Fracture surface of the ACF joint that failed in the shear test showed spalling and less plastic deformation after exposure to autoclave test. Tan and coworkers [70,71] also reported that the stress-corrosion cracking induced by autoclave test conditions reduced the mechanical strength of anisotropic conductive joints and also increased the contact resistance by allowing more moisture to reach the aluminum metallization. The results showed that the epoxy-based ACF absorbed moisture and experienced hygroscopic swelling to degrade the adhesion strength and elasticity in hygrothermal environments.…”

Section: Effects Of Environmental Factors On the Reliability Of Aca Jmentioning

confidence: 99%

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

Lin

Chen

2008

Journal of Adhesion Science and Technology

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New interconnection materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. In particular, anisotropic conductive adhesives (ACAs) have gained popularity as a potential replacement for solder interconnects. Despite numerous benefits, ACA-type packages pose several reliability problems. During the last 10 years, tremendous research and development efforts have been spent on improving the reliability of ACA joints. In this paper, the effects of the bonding process (including the bonding temperature, bonding pressure, curing conditions and reflow processes) on the reliability of ACA joints are presented. Then the effects of the environmental factors (including high temperature, humidity, thermal cycling, impact load, etc.) on the reliability of ACA joints are discussed. Finally, the effects of the properties of the components (including properties of substrates, ACAs, conductive particles and the bump height) on the reliability of ACA joints are reviewed. Additionally, future research areas and remaining issues are pointed out.

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“…were evaluated to improve its bonding reliability [1][2][3][4][5]. The thermal cycling and high temperature/humidity aging tests were conducted to investigate the effects of thermal and hygrothermal aging on the reliability performance of the ACF joints [6][7][8][9][10][11][12][13][14][15]. However there are few investigations on the fatigue reliability of the ACF joints.…”

Section: Introductionmentioning

confidence: 99%

Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads

Gao

Wang

Gao

et al. 2011

Microelectronics Reliability

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Effect of autoclave test on anisotropic conductive joints

Cited by 29 publications

References 5 publications

Effect of drop impact energy on contact resistance of anisotropic conductive adhesive film joints

Effect of drop impact energy on contact resistance of anisotropic conductive adhesive film joints

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads

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