Effect of annealing treatment on electromagnetic shielding effectiveness of double-layer FeSiBCuNb/Cu composite strips

Xu, Wenjie; Qi, Jingtao; Zhang, Yuyang; Zeng, Guoxun; Zhou, Yuxiong; Ou, Hongze; Zhou, Hao; Wu, Yi; Yang, Yuanzheng

doi:10.1007/s10854-022-09740-2

Cited by 2 publications

(2 citation statements)

References 38 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…ii) to manufacture copper-based composites with additions of strengthening elements (e. g. powder-based copper composites with chromium, alumina, or carbon and its nanotubes, copper clad composites with aluminum, magnesium and aluminum, niobium, high entropy alloys, etc. [3][4][5][6][7][8]. iii) to use optimized thermomechanical (deformation) treatment (e. g. via rotary swaging, or methods of severe plastic deformation) [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Kocich,

Kopeček,

Marek

2024

Materialwissenschaft Werkst

View full text Add to dashboard Cite

Copper of a high purity features excellent electric conductivity, but generally very low mechanical properties. Nevertheless, optimized deformation/thermomechanical treatment can introduce favorable combinations of both. The presented study characterizes the correlation of microstructure development and electric properties within copper processed by the severe plastic deformation method of high pressure torsion, the primary advantage of which is that it enables to achieve grains with the sizes in the ultra‐fine, or even nano scales. The study investigates structure development during progressive deformation. In other words, samples processed by single and double high pressure torsion revolutions were evaluated from the viewpoints of grain sizes and grain boundaries, and the results were correlated with the experimentally measured electric conductivity. The single high pressure torsion revolution contributed to grain size decrease, while the structure after double revolution exhibited very fine grains, especially at the sample periphery featuring the highest imposed strain. Both the samples also exhibited increases in microhardness (especially after double revolution), and electric conductivity higher than 100 % IACS. The results confirmed that copper conductors featuring enhanced mechanical properties and favorable electric conductivity can be manufactured by severe plastic deformation.

show abstract

Section: Introductionmentioning

confidence: 99%

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Kocich,

Kopeček,

Marek

2024

Materialwissenschaft Werkst

View full text Add to dashboard Cite

show abstract

“…Among the possibilities how to increase the mechanical properties and simultaneously maintain advantageous electric conductivity is to use modern methods and fabricate Cu-based composites featuring strengthening elements (e.g., powder-based composites with additions of Cr [ 5 ], Al 2 O 3 [ 6 ], and carbon nanotubes [ 7 ], or clad composites consisting of Cu plus Al [ 8 , 9 , 10 , 11 ], Al and Mg [ 12 ], Nb [ 13 ], and FeSiBCuNb [ 14 ]). A favorable way how to increase the mechanical properties without deteriorating the electric ones can also be optimized deformation (thermomechanical) treatment–such as fabrication of electro-conductive wires via rotary swaging [ 15 ] or processing via methods of severe plastic deformation (SPD) [ 16 ].…”

Section: Introductionmentioning

confidence: 99%

High Pressure Torsion of Copper; Effect of Processing Temperature on Structural Features, Microhardness and Electric Conductivity

2023

View full text Add to dashboard Cite

By optimizing the fabrication method, copper components featuring (typically contradicting) advantageous electric conductivity and favorable mechanical properties can be acquired. In this study, we subjected conventional electroconductive copper to a single revolution of high pressure torsion (HPT) at room temperature (RT), searched for the conditions which would yield comparable structure characteristics (grain size) when deformed at a cryogenic temperature, and finally compared the mechanical and electric behaviors to assess specific differences and correlate them with the (sub)structural development. 180° revolution of cryo-HPT imparted structure refinement comparable to 360° revolution of room temperature HPT, i.e., the average grain size at the periphery of both the specimens was ~7 µm. The 360° RT HPT specimen exhibited preferential (111)||SD (shear direction) texture fiber in all the examined regions, whereas the 180° cryo-HPT specimen exhibited more or less randomly oriented grains of equiaxed shapes featuring substantial substructure development of a relatively homogeneous character and massive occurrence of (nano)twins. These structural features resulted in the increase in microhardness to the average value of 118.2 HV0.2 and the increase in the electric conductivity to 59.66 MS·m−1 (compared to 105 HV0.2 and 59.14 MS·m−1 acquired for the 360° RT HPT specimen). The deformation under the cryogenic conditions also imparted higher homogeneity of microhardness distribution when compared to RT processing.

show abstract

Effect of annealing treatment on electromagnetic shielding effectiveness of double-layer FeSiBCuNb/Cu composite strips

Cited by 2 publications

References 38 publications

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Correlation of structure development and electric characteristics within high pressure torsion processed copper

High Pressure Torsion of Copper; Effect of Processing Temperature on Structural Features, Microhardness and Electric Conductivity

Contact Info

Product

Resources

About