Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate

Abstract

Polymer matrix composites, based on brominated epoxy, a type of material widely used in printed circuit boards (PCBs), as matrix and AlN particle as filler were prepared. The influences of AlN content on the mechanical, thermal, and electrical properties of the composites were investigated by uniaxial tensile test, TMA, thermal conductivity measurement, DMA, and dielectric properties measurement. It was found that the properties of composites monotonically varied with AlN content except that maximum tensile strength and strain of composites corresponded to a filler content of 10 wt %. The results of DMA also showed the AlN reinforcement was more pronounced above Tg, and the peak area of tan δ versus T curves decreased with AlN content, which implied the damping capacity of the composite gradually decreased. The increase in Tg and decrease in damping were probably due to strong interaction between the AlN and epoxy matrix inhibiting the mobility of the epoxy chain. In addition, different theoretical models reported in the literature were used to predict the E, CTE, k, and Dk, and compared with the experimental data. Finally, suitable models were recommended in the present materials system. For the significant improvement of performance of epoxy, we can conclude that these composite materials may be promising for PCB substrate. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 1662–1674, 2007

The Thermal Properties of Glass Fiber Reinforced Epoxy Composites with and without Fillers

“…The 3-Glycidyloxypropyl trimethoxysilane used as coupling agent was provided by Sigma Aldrich. Highly pure grades of commercially available, uncoated particles of Silica (SiO 2 , average particle size 12 nm, density 2.6 g/cm 3 ), Alumina (Al 2 O 3 , average filler size 12 nm, density 4.0 g/cm 3 ) were procured from Sigma Aldrich. Alumina trihydrate (ATH) which is microfiller with an average particle size of 2.6 mm was obtained from Akrochem Corporation, USA.…”

“…[2] To effectively solve the thermal dissipation problem and to obtain higher performance, different fillers have been introduced into the polymer to provide thermally conductive but electrically insulative polymer composites. [3] Some electrical and electronic components especially good insulators are made of fiber reinforced polymer matrix composites (PMCs). Although a great deal of information is available on thermal properties of unidirectional glass-epoxy composites, little work has been done with the addition of micro and/or nanofillers.…”

Towards Thermoconductive, Electrically Insulating Polymeric Composites with Boron Nitride Nanotubes as Fillers

“…[6,7] Therefore, the traditional fillers used to improve the thermal conductivity of insulating polymer matrices to date are AlN, Al 2 O 3 , or BN powders made of micrometer-sized particles. [8][9][10] It is worth noting that their corresponding nanoscaled filler materials have been overlooked in the literature because of significant difficulties in the synthesis of large quantities of highly pure AlN, Al 2 O 3 , and BN nanophases. [11][12][13] Boron nitride nanotubes (BNNTs) are electrically insulating counterparts of CNTs as a result of the constant and wide bandgap of $5.5 eV for BN.…”

Effect of the filler size and content on the thermomechanical properties of particulate aluminum nitride filled epoxy composites

“…The addition of AlN will offset some deficiencies of brominated epoxy as substrate materials, such as high CTE, low thermal conductivity, and low strength. 7,[27][28][29] In our previous report, the effect of AlN size on the properties, such as CTE (pre-T g and post-T g ), D k , D f , tensile strength, and Young's modulus, of a brominated epoxy resin were evaluated. 7 However, the very important T g of the composite was not presented or discussed in detail.…”