Effect of Ag content and drawing strain on microstructure and properties of directionally solidified Cu-Ag alloy

Zhao, Haoxiang; Fu, Huadong; Xie, Maohai; Xie, Jun

doi:10.1016/j.vacuum.2018.05.010

Cited by 26 publications

(21 citation statements)

References 20 publications

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“…The morphology of the eutectic colonies observed in this study was similar to that observed in previous studies on Cu-6 pctAg alloys. [20,21,35,40] Furthermore, the Ag-rich eutectic colonies in the Cu-6 pctAg-1 pctCr (Figure 2(c)) and Cu-6 pctAg-1 pctNb alloys (Figure 2(e)) had a larger size compared to that observed in the binary Cu-6 pctAg alloy. The measured area fraction, mean diameter, and interval of the Ag-rich regions in the alloy specimens are given in Table I.…”

Section: Resultsmentioning

confidence: 92%

“…[7] Consequently, the electrical conductivities of the fabricated ODS Cu alloys at room temperature range from 78 to 92 pct International Annealed Copper Standard (IACS), whereas the tensile strength of most ODS Cu wires ranges from 300 to 700 MPa. [4] By contrast, non-oxide high-strength Cu conductors such as Cu-Ag, [8] Cu-Nb, [9] Cu-Cr, [10] and Cu-Fe [11] can be fabricated using the conventional ingot casting process, which has a high production efficiency. During the ingot casting process, dispersed metal phases (Ag, Nb, Cr, and Fe) are formed in the Cu alloys.…”

Section: Introductionmentioning

confidence: 99%

“…[20] For example, Cu-6 pctAg alloy has a lower tensile strength compared to alloys with higher Ag fractions such as Cu-12 pctAg and Cu-24 pctAg. [21] However, the properties of Cu-6 pctAg alloy can be improved by appropriately combining casting and heat treatment techniques. [12] In addition, the cost of Cu-Ag alloy significantly decreases with a decrease in the Ag content.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Alloying Elements on the Microstructure and Performance of Cu-6 pctAg In-Situ Composites

Zhang

Guo

Zhaoyan

et al. 2020

Metall Mater Trans A

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As candidates for conductors used in high-field extreme conditions, Cu-Ag in-situ composites are required to possess high strength and conductivity; however, most Cu-Ag in-situ composites do not possess both characteristics. Therefore, it is important to determine the appropriate composition design of Cu-Ag composites that can enhance the mechanical properties while maintaining a relatively good electrical conductivity. This paper describes the effect of several potential alloying elements (Cr, Nb, and Zr) on the microstructures and mechanical properties of Cu-6 pctAg in-situ composites. The results reveal that the addition of both Cr and Nb refined the morphology of the Ag filaments and considerably improved the tensile strengths of the drawn Cu-Ag composites at large strains. Particularly, the ultimate tensile strengths of the Cu-6 pctAg-1 pctCr composites were improved by approximately 23 pct than that of the Cu-6 pctAg binary composites, with only a slight loss in conductivity. By contrast, the addition of 1 pctZr to the Cu-Ag composites had a negative effect on the morphology of the Ag filaments; it only improved the hardness at low drawing stains while reducing both the tensile strength and electrical conductivity.

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Section: Resultsmentioning

confidence: 92%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Effect of Alloying Elements on the Microstructure and Performance of Cu-6 pctAg In-Situ Composites

Zhang

Guo

Zhaoyan

et al. 2020

Metall Mater Trans A

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“…Compared with Figure 2e, h, and k, the continuous network eutectic structure in the longitudinal section of the as-cast rod is gradually drawn into long fibers during multi-pass continuous drawing. Those fibers are approximately completely parallel to the axial direction as a function of drawing strain and its space is getting smaller and smaller [33]. In addition, longitudinal macrophotographs in Figure 2a, d, g, and j show that the space of the peripheral fibers is much smaller than that of the core, indicating that the deformation of the periphery in the wire is significantly greater than that of the core during multi-pass continuous drawing [34].…”

Section: Microstructure and Texturementioning

confidence: 93%

Microstructural evolution and properties of Cu–20 wt% Ag alloy wire by multi-pass continuous drawing

Cheng

Song

Mi³

et al. 2020

Nanotechnology Reviews

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The Cu–20 wt% Ag alloy wire rod was prepared using three-chamber vacuum cold mold vertical continuous up-casting followed by multi-pass continuous drawing. The evolution of microstructure, mechanical property, and electrical property of the Cu–20 wt% Ag alloy wire during multi-pass continuous drawing was studied. After multi-pass continuous drawing, the continuous network eutectic structure in the longitudinal section of the as-casted rod was gradually drawn into long fibers that approximately parallel to the axial direction, while the space of the continuous network eutectic structure in the transverse section is getting smaller and smaller. Both the preferred orientation of copper and silver grains are (1,1,1). With the increase of drawing strain (η), the tensile strength of Cu–20 wt% Ag alloy wire gradually increases while the elongation gradually decreases. When the diameter is drawn to 0.02 mm (η = 11.94), the tensile strength of the alloy is 1,682 MPa and elongation is 2.0%. The relationship between tensile strength, elongation, and diameter conforms to Allometric and Boltzmann functions, respectively.

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“…As a typical type of aging hardening alloys, Cu-Cr based alloys have high strength and moderate electrical conductivity, thus they are being applied to contact wires for high speed trains [1][2][3][4], lead frames [5][6][7], heat transfer [1,8], and so on. There are normally two ways to improve the alloy performance-optimization of heat treatment and addition of alloying elements [9][10][11][12]. For the Cu-Cr based alloys, common alloying elements include Zr [1,13,14], Ag [14][15][16], Mg [6,7,13], and Ti [17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Solidification microstructure of Cu–Cr and Cu–Cr-In alloys

Zhu¹,

Liao²,

Chen³

et al. 2020

Mater. Res. Express

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Solidification microstructure of Cu-Cr and Cu-Cr-In alloys has been characterized using scanning electron microscopy in the present work. Thermodynamic database has been established for the Cu-Cr binary system and Cu-Cr-In ternary system. Solidification behaviors of the two alloys have been simulated using the thermodynamic parameters based on Scheil model. The results show that the primary Cr phases with long and thin dendrites can be observed between Cu matrix grains for the Cu-Cr alloy, and the 'flower-like' coarsen dendrites primary Cr phases of the Cu-Cr-In alloy exist in the triangular grain boundary areas. The weight percent of indium element in the liquid phase of the Cu-Cr-In alloy during solidification continuously increases up. This will enlarge the solidification temperature range from 6°C to 214°C resulting in longer time for the dendrite growth and the alloying element indium with low melting point tends to segregate to the grain boundary region.

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Effect of Ag content and drawing strain on microstructure and properties of directionally solidified Cu-Ag alloy

Cited by 26 publications

References 20 publications

Effect of Alloying Elements on the Microstructure and Performance of Cu-6 pctAg In-Situ Composites

Effect of Alloying Elements on the Microstructure and Performance of Cu-6 pctAg In-Situ Composites

Microstructural evolution and properties of Cu–20 wt% Ag alloy wire by multi-pass continuous drawing

Solidification microstructure of Cu–Cr and Cu–Cr-In alloys

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