Effect of additives on plating rate and bath stability of electroless deposition of nickel-phosphorus-boron on aluminum

El‐Rehim, Sayed S. Abd; Shaffei, M.F.; El-Ibiari, N.N.; Halem, S. Abdel

doi:10.1016/s0026-0576(96)80087-0

Cited by 16 publications

(7 citation statements)

References 2 publications

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“…Figure shows the B content in the coatings as a function of the Ni 2+ (a) and the 2-MBT stabilizer agent contents in the electroless bath. It is observed a slight increase in B content with the increase of the Ni 2+ , whereas it decreases with the increase in the stabilizer agent; this latter result has previously been observed. − , For our coatings, the B content can be changed from 3 to 16% by increasing the 2-MBT in the range shown in Figure b).…”

Section: Resultssupporting

confidence: 83%

“…An important result in this work is that the porosity of the coating decreases when the 2-MBT content is below 0.5 ppm but increases linearly for a larger 2-MBT concentration. − In electroless baths used to produce Ni–P–B coatings, stabilizers such as cadmium sulfate, lead chloride, 2-MBT, and sodium saccharin are commonly used, it is reported that the bath stability increases when PbCl 2 and the 2-MBT are used in concentrations in the range of 0.1 to 0.2 mg/L. The Ni–P–B electroless coatings with 2-MBT as stabilizer produce films with large grain size, but with rough surfaces, which do not have an attractive appearance .…”

Section: Introductionmentioning

confidence: 83%

“…Many studies with different stabilizers have been carried out, among those are salts that contain, lead, iodide, 2-mercaptobenzothiazole (2-MBT), malic acid, and sulfanates anions. Those studies revealed that those stabilizers retard the rate of deposition, reduced the amount of phosphorus, and incorporate some sulfur and lead into the coating when deposited in the presence of 2-MBT. − …”

Section: Introductionmentioning

confidence: 99%

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Measurement of Mechanical Properties of an Electroless Ni–B Coating Using Nanoindentation

Domínguez-Ríos

Hurtado-Macías

Torres-Sanchez

et al. 2012

Ind. Eng. Chem. Res.

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Structure and mechanical properties of electroless nickel-boride (Ni−B) thin film coatings on S7 steel substrate were studied in as-plated and annealed samples. The electroless bath does not contain Pb, Cd, or Ta in the stabilizer agents. The mechanical properties of the Ni−B coatings were obtained from nanoindentation measurements. Models by Korsusky and King were used to obtain hardness and elastic modulus, respectively. The structure of the coatings was observed by atomic force and scanning electron microscopy and XRD. Bath composition, plating time, annealing temperature, and time were considered in order to prepare coatings with optimal mechanical properties.

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Section: Resultssupporting

confidence: 83%

Section: Introductionmentioning

confidence: 83%

Section: Introductionmentioning

confidence: 99%

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Measurement of Mechanical Properties of an Electroless Ni–B Coating Using Nanoindentation

Domínguez-Ríos

Hurtado-Macías

Torres-Sanchez

et al. 2012

Ind. Eng. Chem. Res.

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“…The decomposition of the deposition bath has been attributed to reducing excess Ni 2+ to the metallic state in the bulk of the solution [22,23]. An increase in the NaBH 4 concentration can result in many electrons, which are used to reduce Ni 2+ ions.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Electroless Nickel–Boron Deposit from Optimized Stabilizer-Free Bath

et al. 2021

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Conventional electroless nickel–boron deposits are produced using solutions that contain lead or thallium, which must be eliminated due to their toxicity. In this research, electroless nickel–boron deposits were produced in a stabilizer-free bath that does not include any toxic heavy metal. During processing, the plating rate increased from 10 to 14.5 µm/h by decreasing the concentration of the reducing agent, leading to increased bath stability. The thickness, composition, roughness, morphology, hardness, wear, and corrosion resistance of the deposits were characterized. The new deposit presents an excellent hardness of 933 ± 56 hv50, 866 ± 30 hk50, and 12 GPa from the instrumented indentation test (IIT), respectively, which are similar to that of hexavalent hard chromium coating. Moreover, by using both potentiodynamic polarization and salt spray tests it was shown that the coating presents higher corrosion resistance as compared to standard nickel-boron coatings. The new deposit exhibits properties close to those of the conventional electroless nickel–boron deposits. Therefore, it could replace them in any industrial applications.

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“…Heavy metal cations, especially Pb 2+ , are known as effective reagents , to inhibit the propagation of Ni colloidal particles. The heavy metal ions are generally thought to furnish a geometric block via adsorption on the plating frontier of Ni seeds. However, this explanation is unsatisfactory due to two experimental facts: (1) there is a rather large gap in Pb 2+ concentration between the minimum and the critical levels, in which the plating rate of Ni slows down, and (2) the content of phosphorus in the Ni−P deposition film decreases with increasing concentration of Pb 2+ .…”

Section: Introductionmentioning

confidence: 99%

Role of a Pb²⁺ Stabilizer in the Electroless Nickel Plating System: A Theoretical Exploration

2004

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The electroless nickel plating process involves multiple chemical reactions that interrelate mutually in intricate ways and take place almost simultaneously. This work attempts to provide a theoretical template for understanding this complicated system from the role of heavy metal stabilizers. Pb 2+ ion was selected for the study because it is the most effective species in this category. A theoretical expression of the nickel deposition rate is created by envisioning the Stern-Grahame electrical double layer presumably attached to the plating frontier (the inner Helmholtz plane) as a one-dimensional potential well and the electron transfer from the Fermi level of plating frontier to Ni 2+ ions at the outer Helmholtz plane as the quantum tunneling effect. The deposition of P atoms is assumed to go through the oxidative-addition of hypophosphite (H 2 PO 2 -) ions at Ni atoms on the plating frontier and on this basis its theoretical deposition rate is developed. Another adsorption state of H 2 PO 2on the surface Ni atoms is proposed to form by its two oxygen atoms, and the P(I) center supplies electrons to the plating frontier through these two oxygen bridges. Establishing the relationship between Pb 2+ -ion concentration and the Fermi level of the plating frontier (i.e., inside the solid Ni-P alloy deposition layer on the plating substrate) is an important step for deriving the nickel and element phosphorus deposition rates. The stabilizing effect of the lead ion is attributed to its participation as the neutral atom in the lattice of the Ni-P film at the plating frontier, which results in the ascension of Fermi energy. Thus, the oxidation of hypophosphite at the plating frontier is retarded, which in turn slows down the deposition of both Ni and P that needs electrons. The dependence of the deposition rates of Ni and P on concentrations of Pb 2+ ion was experimentally examined. It is found that the theoretical models predict well the experimental trends. The parameters designated in the theoretical model are determined through a self-consistent computation procedure.

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Effect of additives on plating rate and bath stability of electroless deposition of nickel-phosphorus-boron on aluminum

Cited by 16 publications

References 2 publications

Measurement of Mechanical Properties of an Electroless Ni–B Coating Using Nanoindentation

Measurement of Mechanical Properties of an Electroless Ni–B Coating Using Nanoindentation

Characterization of Electroless Nickel–Boron Deposit from Optimized Stabilizer-Free Bath

Role of a Pb²⁺ Stabilizer in the Electroless Nickel Plating System: A Theoretical Exploration

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Effect of additives on plating rate and bath stability of electroless deposition of nickel-phosphorus-boron on aluminum

Cited by 16 publications

References 2 publications

Measurement of Mechanical Properties of an Electroless Ni–B Coating Using Nanoindentation

Measurement of Mechanical Properties of an Electroless Ni–B Coating Using Nanoindentation

Characterization of Electroless Nickel–Boron Deposit from Optimized Stabilizer-Free Bath

Role of a Pb2+ Stabilizer in the Electroless Nickel Plating System: A Theoretical Exploration

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Role of a Pb²⁺ Stabilizer in the Electroless Nickel Plating System: A Theoretical Exploration