Effect of Additive Element on Fatigue Properties of Sn-Sb-Ag High Temperature Lead-Free Solder

Mitsui, Kohei; Yamamoto, M.; Kawai, Kentaro; Kobayashi, Tatsuya; Shohji, Ikuo; Watanabe, Hirohiko

doi:10.5104/jiep.jiep-d-22-00081

Journal of Japan Institute of Electronics Packaging

2023

DOI: 10.5104/jiep.jiep-d-22-00081

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Effect of Additive Element on Fatigue Properties of Sn-Sb-Ag High Temperature Lead-Free Solder

Kohei Mitsui

M. Yamamoto

Kentaro Kawai

et al.

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Effect of Additive Element on Fatigue Properties of Sn-Sb-Ag High Temperature Lead-Free Solder

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