Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

“…23 In surprising contrast, the same authors showed a continuous decrease of the average thickness of the IMC at the interface up to 3.0 wt.% of nano ZrO 2 using Au/Ni metallized Cu pads. 13 Our experimental results showed that the average total thickness of the IMC layer formed at the Cu/solder/ Cu interfaces using the SAC305 solder paste is higher compared with the literature data (Fig. 5).…”

“…As a result, this sideeffect is responsible for a reduction of the improving effects, because nanoparticle agglomerates are generated both in the solder matrix and at the interface solder/substrate in the solder joints. In contrast, Gain et al 13 reported a continuous increase of the shear strength for Sn3.0Ag0.5Cu (wt.%) (SAC305) solder joints reinforced with nano ZrO 2 up to 3.0 wt.%. On the other hand, Tsao et al 9 indicated an insignificant increase of this feature within the addition interval between 0.25 wt.% and 1.00 wt.% of nano Al 2 O 3 .…”

Microstructure and mechanical properties of lead-free Sn-Cu-Ni composite solder paste reinforced with silicon (Si) particles

“…The presence and distribution of Si particles can influence the deformation characteristics of solder joint by inhibiting grain boundary sliding and also act as obstacle for the dislocation movement. Improvement in shear strength also reported by Gain et al [13] through their study of SAC-ZrO 2 composite solder on the microstructure and shear strength on Cu pad. They found out that the reinforced SAC has shown an increased in shear strength compared to the unreinforced SAC solder joint.…”

“…When increase amount of reinforcement particles in the solder, it will cause more reinforcement particles precipitate on the top of the substrate thus produce more nucleation site. The increase in nucleation probability of Cu 6 Sn 5 grains consequently leads to the refinement of the grains [11], [12]. These statement was supported by Tang …”

Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles

“…In a typical Pb-free solder joint, Cu6Sn5, which may form either as primary crystals or an interfacial layer during soldering can play a determining role in solder joint strength. There is evidence that by suppressing the Cu6Sn5 interfacial layer, solder joint properties could be improved [13][14][15][16][17] and as such there are benefits associated with controlling the growth of this layer during multiple reflows.It has recently been reported that additions of reinforcement to a variety of solder matrices, with compounds including silicon carbide (SiC) [18][19][20], nickel oxide (NiO) [21], alumina (Al2O3) [22][23][24], zirconia (ZrO2) [25][26][27][28], titanium oxide (TiO2) [29][30][31][32][33][34] and silicon nitride (Si3N4) [35,36] result in suppression of the growth of the interfacial layer during soldering [37]. In our recent study [38], we developed a method of fabricating a reinforced solder using a powder metallurgy microwave sintering method that results in a homogeneous distribution of TiO2 in the solder material and an improvement in the bulk solder material thermal and mechanical properties.…”