Effect of Addition Elements on Creep Properties of the Sn-Ag-Cu Lead Free Solder

Nagano, Makoto; Hidaka, Noboru; Watanabe, Hirohiko; Shimoda, Masayoshi; Ono, Masahiro

doi:10.5104/jiep.9.171

Cited by 14 publications

(11 citation statements)

References 1 publication

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“…However, their poor ductility is the major problem limiting the application of SnBi-based solders in circuit boards. 9,10) Aiming to solve this problem, Takao et al 11) reported that SnBi and SnBiCu alloys show superplasticity. However, the superplasticity mechanism for these alloys remains unclear.…”

Section: Introductionmentioning

confidence: 99%

Tensile Behavior and Superplastic Deformation of Sn–Bi–Cu Alloy

Umeyama

Yamauchi

2019

Mater. Trans.

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The purpose of this study is to clarify the tensile behavior and deformation mechanism of the Sn40Bi0.1Cu alloy (mass%). Tensile tests of Sn40Bi0.1Cu were performed at temperatures of 298, 333, and 353 K and strain rates from 5.25 © 10 ¹5 to 5.25 © 10 ¹2 s ¹1 . The tensile strength decreased and the elongation increased with increasing temperature and decreasing strain rate. Sn40Bi0.1Cu shows superplastic behavior at temperatures of >333 K and low strain rates of <5.25 © 10 ¹4 s ¹1 . Microstructural observation after superplastic deformation of Sn40Bi0.1Cu showed that the primary crystal Sn grains could not deform along the axial direction of applied tension in the superplastic regime. The eutectic phase contributed to superplastic deformation. The strain rate sensitivity m for Sn40Bi0.1Cu was <0.3.

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Section: Introductionmentioning

confidence: 99%

Tensile Behavior and Superplastic Deformation of Sn–Bi–Cu Alloy

Umeyama

Yamauchi

2019

Mater. Trans.

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“…5 shows the relationship between fatigue life and inelastic strain range. In both alloys, the results obey the Manson-Coffin equation expressed in the equation (1). At 25 o C, Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge has the similar fatigue life to Sn-3.0Ag-0.5Cu.…”

Section: Resultsmentioning

confidence: 56%

“…Thus lead-free solder which has high mechanical and thermal reliability is required for such applications. Then Sn-Ag-Cu-Ni-Ge solder has been developed to improve the reliability of the solder joint [1][2][3]. The addition of small amount of Ni into Sn-Ag-Cu solder inhibits growth of primary β-Sn phases so that the strength degradation of solder is suppressed under aging at high temperature and its mechanical properties are relatively stable.…”

Section: Introductionmentioning

confidence: 99%

Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder

Yokoi

Kobayashi

Shohji

2018

MSF

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Tensile and low cycle fatigue properties of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge (mass%) lead-free solder were investigated using miniature size specimens and obtained data were compared to those of Sn-3.0Ag-0.5Cu (mass%). The microstructure of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge consists of dendritic β-Sn phases and ternary eutectic phases surrounding them which are composed of β-Sn, (Cu,Ni)6Sn5 and Ag3Sn. Tensile strength and 0.1% proof stress of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge are superior to those of Sn-3.0Ag-0.5Cu at 25°C and 150°C. However, elongation of it is inferior to that of Sn-3.0Ag-0.5Cu at both temperatures. Fatigue lives of both alloys obey the Manson-Coffin equation and are analogous at 25°C. Although fatigue lives of both alloys decrease at 150°C, the fatigue life of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge is inferior to that of Sn-3.0Ag-0.5Cu. At 150°C, the crack mainly progresses at grain boundaries of recrystallized grains. Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge has several grain boundaies which can be the origin of the crack so that fatigue lives degrade at 150°C.

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“…Solder material is used in the follow- ing parts in IGBT modules: (1) IGBT chips, joining areas of the copper circuit and (2) DCB substrate, joining areas of the copper base. As for (1), Fuji Electric has been using lead-free solder [8] since 1998 and has succeeded in improving power cycle reliability. [9] In this new package, we developed a DCB substrate that complies with the leadfree requirement.…”

Section: Rohs-compliant Igbt Module Structurementioning

confidence: 99%

Development of a New-Generation RoHS IGBT Module Structure for Power Management

Nishimura

Nishizawa

Mochizuki

et al. 2008

Transactions of The Japan Institute of Electronics Packaging

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This paper describes the design considerations for a high electric power density IGBT module structure mounted with smaller, new-generation chips. We have investigated heat flow depending on the copper foil thickness of an alumina based direct-copper-bonding (DCB) substrate, junction temperature rise in relation to the chip arrangement, electromagnetic noise dominated by the cupper circuit pattern, and lead-free solder layer stress as affected by the coefficient of thermal expansion (CTE) of DCB.Low thermal resistance was obtained by using a 0.6 mm thick copper DCB substrate; consequently the CTE of the DCB increased to 16 ppm/K, which is nearly equal to that of the Cu base as a heat sink. The thick copper DCB substrate can lower the junction temperature of a small chip with a high electric power density and can improve the thermal cycling capability of the DCB substrate mounted with a lead-free solder on the Cu base. Moreover the thick copper circuit effectively reduces the electromagnetic noise generated on the DCB substrate. Thus we have successfully realized a high electric power density IGBT module structure.

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Effect of Addition Elements on Creep Properties of the Sn-Ag-Cu Lead Free Solder

Cited by 14 publications

References 1 publication

Tensile Behavior and Superplastic Deformation of Sn–Bi–Cu Alloy

Tensile Behavior and Superplastic Deformation of Sn–Bi–Cu Alloy

Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder

Development of a New-Generation RoHS IGBT Module Structure for Power Management

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