2012
DOI: 10.1007/s10909-012-0476-z
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Effect of a Thin AlOx Layer on Transition-Edge Sensor Properties

Abstract: We have studied the physics of transition-edge sensor (TES) devices with an insulating AlOx layer on top of the device to allow implementation of more complex detector geometries. By comparing devices with and without the insulating film, we have observed significant additional noise apparently caused by the insulator layer. In addition, AlOx was found to be a relatively good thermal conductor. This adds an unforeseen internal thermal feature to the system.

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Cited by 2 publications
(3 citation statements)
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References 9 publications
(11 reference statements)
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“…Furthermore, from the high values of C 2 obtained above, and from previous measurements in Ref. 32 , we suspect that the AlOx layer could be responsible for the high value of C 2 . Therefore, we also studied devices where only a quarter "slice" of the full CorTES disk is retained: this way the insulator layer is not required, as the center contact lead can come from the opposite side (see inset Fig.…”
Section: Slice Tessupporting
confidence: 64%
See 1 more Smart Citation
“…Furthermore, from the high values of C 2 obtained above, and from previous measurements in Ref. 32 , we suspect that the AlOx layer could be responsible for the high value of C 2 . Therefore, we also studied devices where only a quarter "slice" of the full CorTES disk is retained: this way the insulator layer is not required, as the center contact lead can come from the opposite side (see inset Fig.…”
Section: Slice Tessupporting
confidence: 64%
“…This could be because of the 120 nm thick AlOx insulator layer separating the Nb bias lines [1(b)] in the CorTES device, creating unwanted thermal links and heat capacity inside, as shown in Ref. 32 for a different device. Very accurate determination of how the addition of the absorber affected the detector characteristics is unfortunately complicated, because the absorber processing changed also the transition properties, by lowering the T c from 98 mK to 85 mK, and by broadening the transition.…”
Section: Resultsmentioning
confidence: 99%
“…The exact processes that roughen the silicon are unclear, but the likely candidates are micro-masking due to non-volatile species in the plasma, and slower etch of native and in-situ NbO x in the fluorine chemistry. The use of an etch stop such as 100 nm thick AlO x was successfully employed in early devices, however, these detectors exhibited very large uncontrolled heat capacity due to the amorphous nature of the etch stop [24]. Test devices were also fabricated with a lift-off process that left the beam surfaces smooth.…”
Section: Diffusive-ballistic Conductancementioning
confidence: 99%