Effect of a Backing Material on the Bendability of Flexible Substrates with Passive SMD components

Sondhi, Kartik; Avuthu, Sai Guruva Reddy; Richards, Nathaniel; Fan, Zhihong; Nishida, Toshikazu

doi:10.1109/ectc32862.2020.00242

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020

DOI: 10.1109/ectc32862.2020.00242

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Effect of a Backing Material on the Bendability of Flexible Substrates with Passive SMD components

Kartik Sondhi

Sai Guruva Reddy Avuthu

Nathaniel Richards

et al.

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Effect of a Backing Material on the Bendability of Flexible Substrates with Passive SMD components

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References 18 publications

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