Effect of 4-point bending test procedure on crack propagation in thin film stacks

Ključar, Luka; González, Mario; Vanstreels, Kris; Ivankovic, A.; Hecker, M.; Wolf, Ingrid De

doi:10.1016/j.mee.2014.09.006

Cited by 4 publications

(1 citation statement)

References 5 publications

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“…Dupont et al, 2013;Gandhi et al, 2007;Huang et al, 2005;Hughey et al, 2004; J. K. Y. Kim et al, 2012;Ključar et al, 2015;Lee et al, 2012;Lemonds et al, 2002). The glue then acts as an interlayer which might dissipate energy that is extrinsic to the true toughness of the interface.…”

Section: Introductionmentioning

confidence: 99%

Interface toughening in multilayered systems through compliant dissipative interlayers

Dépinoy

Strepenne

Massart

et al. 2019

Journal of the Mechanics and Physics of Solids

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The effect on an interlayer on the toughness of an interface between a ductile thin film and an elastic substrate is investigated by finite element modeling and assessed towards experimental measurements. The model is based on an asymptotic K-field formulation relying on cohesive zone elements to simulate the fracture process. A compliant interlayer tends to increase the interface toughness by promoting plastic dissipation in the thin layer. Additional toughening can result from the development of plastic strains in the interlayer. The magnitude of these two toughening mechanisms depends on the film thickness, among other parameters. The model predictions are confirmed by comparison with wedge-opening test data performed on a multilayer composed of a thin Cu layer and a polymer interlayer embedded between two stainless steel substrates. These findings lay the foundation for the design of tougher multilayers and provide a critical assessment of 2 experimental protocols for interface toughness measurements requiring the bonding of a dummy substrate, such as used for DCB or four point bending tests.

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