Abstract:A fundamental understanding of crystal growth dynamics during directional solidification of multicrystalline Si (mc-Si) is crucial for the development of crystal growth technology for mc-Si ingots for use in solar cells. In situ observation of the crystal/melt interface is a way to obtain direct evidence of phenomena that occur at a moving crystal/melt interface during growth. In this review, some of the phenomena occurring in the solidification processes of mc-Si are introduced based on our in situ observatio… Show more
“…Meanwhile, the melting processes could form different self-organized shaped structures of Si crystals. 4,5) For example, spherical crystals 6,7) and a variety of dendrites 8,9) grow from melted Si. Hemispherical Si islands grow through solid-film dewetting, 10,11) and cone-like Si structures are fabricated by local heating with focused laser irradiation.…”
Silicon (Si) protrusions were grown by local surface melting and resolidified on a Si(111) fragment with a narrow current path that was fabricated using a microgrinder at the center of the fragment. The narrow path was resistively heated by passing a current through it until it burned. The surface of the narrow path and fragment gradually melted with increasing current, and the melted Si started to flow from the narrow path to its sides owing to the surface tension of the melted Si. When the fragment surface near the path was locally irradiated with an electron-beam, melted Si accumulated in the irradiation region, resulting in Si protrusions of ~600 µm in height. The formation mechanism of the Si protrusion was discussed based on in-situ optical microscope observations up to the burn-out of the Si narrow path.
“…Meanwhile, the melting processes could form different self-organized shaped structures of Si crystals. 4,5) For example, spherical crystals 6,7) and a variety of dendrites 8,9) grow from melted Si. Hemispherical Si islands grow through solid-film dewetting, 10,11) and cone-like Si structures are fabricated by local heating with focused laser irradiation.…”
Silicon (Si) protrusions were grown by local surface melting and resolidified on a Si(111) fragment with a narrow current path that was fabricated using a microgrinder at the center of the fragment. The narrow path was resistively heated by passing a current through it until it burned. The surface of the narrow path and fragment gradually melted with increasing current, and the melted Si started to flow from the narrow path to its sides owing to the surface tension of the melted Si. When the fragment surface near the path was locally irradiated with an electron-beam, melted Si accumulated in the irradiation region, resulting in Si protrusions of ~600 µm in height. The formation mechanism of the Si protrusion was discussed based on in-situ optical microscope observations up to the burn-out of the Si narrow path.
The temperature eld distribution during the growth of crystalline silicon by the directional solidi cation (DS) method is an important factor affecting the growth rate, the shape of the melt-crystal (m-c) interface, and thermal stress. To solve the problem of m-c interface convexity at the early stage of crystal growth caused by supercooling at the bottom center of silicon ingot during DS. In this paper, a two-dimensional global transient numerical model based on a large-size ALD-G7 (G7) crystalline silicon ingot furnace is established and experimentally veri ed. Based on the model, the in uence of different bottom thermal gate moving process curves on the convexity of the m-c interface at the early stage was studied, with emphasis on the changes in temperature eld, m-c interface, and thermal stress at the early stage of crystal growth. We have designed three cases, case 1 uses the original moving process curve of bottom thermal gate, case 2 and case 3 adjust the process curve to 0.95 and 0.9 of the original ratio, respectively.The numerical results show that the center cooling condition of silicon ingot and the convexity of the m-c interface are improved with the decreasing of thermal gate moving rate. Compared with case 1, the convexity of case 2 and case 3 is reduced by 55% and 44% on average, respectively.
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