Abstract:Purpose
This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpage behavior for different form factor sizes.
Design/methodology/approach
This study analyzes warpage during the reflow process. The shadow moiré experiment methodology is used to collect data on the dynamic warpage performance of a model with a form factor of 10mm × 10mm × 1mm. The temperature profile with heating from 25°C to 300°C… Show more
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