2021
DOI: 10.3390/s21030926
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Dynamic Temperature Management of Near-Sensor Processing for Energy-Efficient High-Fidelity Imaging

Abstract: Vision processing on traditional architectures is inefficient due to energy-expensive off-chip data movement. Many researchers advocate pushing processing close to the sensor to substantially reduce data movement. However, continuous near-sensor processing raises sensor temperature, impairing imaging/vision fidelity. We characterize the thermal implications of using 3D stacked image sensors with near-sensor vision processing units. Our characterization reveals that near-sensor processing reduces system power b… Show more

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Cited by 14 publications
(9 citation statements)
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“…It is important to note that the energy metric presented in this work is based on the assumption that the front-end and back-end chips are closely located on the same printedcircuit board [15]. In general, the front-end and back-end sensors could be separated by large distances, necessitating long energy-expensive wired or wireless data transfer (which is common for the case of sensor-fusion and swarm intelligence applications).…”
Section: Conclusion and Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…It is important to note that the energy metric presented in this work is based on the assumption that the front-end and back-end chips are closely located on the same printedcircuit board [15]. In general, the front-end and back-end sensors could be separated by large distances, necessitating long energy-expensive wired or wireless data transfer (which is common for the case of sensor-fusion and swarm intelligence applications).…”
Section: Conclusion and Discussionmentioning
confidence: 99%
“…E com is computed from e com as shown in Eq. ( 4), and its value shown in Table IV is obtained from [15]. On the other hand, E soc in primarily dominated by multiply-and-add (MAdd) energy of the models used for detection (E mac ).…”
Section: E Reduction In Energy Consumptionmentioning
confidence: 99%
“…To address the compute-efficiency, latency, and throughput bottlenecks of 2D computer vision algorithms, recent research have proposed several processing-near-sensor (PNS) [12,13], processing-in-sensor (PIS) [14], and PIP solutions [15,16]. PNS approaches incorporate a dedicated machine learning (ML) accelerator chip on the same printed circuit board [12], or 2.5D/3D stacked with a pixel chip [13]. PIS approaches, in contrast, leverage parallel analog computing in the peripheral circuits of a memory array [14].…”
Section: Energy-efficient On-device Visionmentioning
confidence: 99%
“…The FLOPs count is computed as the total number of multiply-and-accumulate (MAC) operations in the convolutional and linear layers, similar to [24,25,26], while the peak memory is evaluated using the same convention as [27]. The total energy is computed as the sum of the image sensor energy, the sensor-to-SoC communication energy obtained from [12], and the energy incurred in processing the CNN layers. Note that the sensor energy is the sum of the pixel array energy 2 that is obtained from our circuit simulations and the ADC energy that is obtained from [28].…”
Section: Analysis Of Energy-efficiencymentioning
confidence: 99%
“…For all other uses, contact the owner/author(s). MobiSys '22, June 25-July analog signal chain [1,5] as the fundamental bottleneck for energyefficiency. Specifically, analog circuits alone can consume anywhere from 33% to 85% of camera power.…”
Section: Introductionmentioning
confidence: 99%