The purpose of this research is studying microstructure, the resistivity of Cu/Ni film produced by electroplating on the various mass fraction of Ni in the electrolyte. Then the film is tested for its performance as a temperature sensor. The electrolyte solution was made from mixing of NiSO 4 , NiCl 2 , H 3 BO 3 , and H 2 O. Plating was conducted on power 1.5 V and 60°C bath temperature. The results showed deposits containing Ni and NiO. The X-ray diffraction parameters of Ni[111] and NiO[111] such as intensity, d-spacing and grain size on variations of Ni mass fraction in solution followed the parameters diffraction of Cu[111]. The resistivity is contributed by competition between those three diffraction parameters. Testing Cu/Ni films for sensing the temperature of liquid nitrogen (0°C to-140°C) shows that all samples have exhibited their performance as low-temperature sensors. The temperature has a linear relationship to the output voltage of the sensor with the sensitivity ranging from 0.7510-3 V/°C to 1.0510-3 V/°C. The highest sensitivity in accordance to the sample produced from 8.83 g Ni in the electrolyte.