“…Today, moiré interferometry is used for many studies [1]. It has been applied for studies of composite materials [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18], polycrystalline materials [1,19], piezoelectric materials [20], fracture mechanics [21][22][23][24][25][26][27][28], biomechanics [29], structural elements [30,31], structural joints [32][33][34][35], residual stress measurement [36][37][38][39][40][41][42] and strain gauge calibration [1,43]. More recently, it has been practised extensively in the microelectronics industry to measure thermally induced deformation of electronic packages [44][45][46]…”