Dynamic modeling of a silicon bulk-micromachined microaccelerometer

Rodrigues, Janderson R.; Góes, Luiz Carlos Sandoval; Passaro, Angelo; Mateus, C.F.R.

doi:10.5540/03.2013.001.01.0140

Cited by 3 publications

(10 citation statements)

References 9 publications

(6 reference statements)

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“…This suggested geometry (Figure 2), the dimensions of which are presented in Table 1, has been employed as a spring for a high-performance accelerometer (Rodrigues et al 2011).…”

Section: Resultsmentioning

confidence: 99%

“…The three silicon wafers have orientation (100) and a thin layer of silicon oxide (Figure 2b) is used as the electrical insulation between them. Some specifications have been employed for the accelerometer, focusing on unmanned aerial vehicles, such as sensitivity (500 mV/g), operating temperature (45-125°C), width band (400 Hz) and footprint area that allows it be encapsulated in a 20-pin low-temperature cofired ceramic (LTCC) (Rodrigues et al 2011).…”

Section: Resultsmentioning

confidence: 99%

“…Then, different uncertainties and reliability levels are specified and the results of the RBDO are compared with the initial design and the deterministic optimum solution. The structural analyses required for these studies are based on analytical formulae found in Rodrigues et al (2011), which evaluate the resonance frequency (f n ) and sensitivity (S e ) of high-performance accelerometers.…”

Section: Resultsmentioning

confidence: 99%

“…As mentioned previously, having a small footprint area is an important requirement for the accelerometer, to allow it be encapsulated in a 20-pin LTCC (Rodrigues et al 2011). Therefore, to achieve a large reduction in the width of accelerometer device, the deterministic optimization problem is stated as:…”

Section: Deterministic Solutionmentioning

confidence: 99%

“…Table 2 shows all the design variables (s) adopted in the deterministic optimization, as well as the lower (s low ) and upper (s upp ) limits, and the optimized values obtained by the deterministic problem (5). A comparison of the original design ( Figure 2) proposed for the accelerometer (Rodrigues et al 2011) and the optimized geometric configuration obtained by the deterministic problem can be seen in Figure 3.…”

Section: Deterministic Solutionmentioning

confidence: 99%

See 4 more Smart Citations

Structural design of high-performance capacitive accelerometers using parametric optimization with uncertainties

Teves

Lima

Passaro³

et al. 2016

Engineering Optimization

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Electrostatic or capacitive accelerometers are among the highest volume microelectromechanical systems (MEMS) products nowadays. The design of such devices is a complex task, since they depend on many performance requirements, which are often conflicting. Therefore, optimization techniques are often used in the design stage of these MEMS devices. Because of problems with reliability, the technology of MEMS is not yet well established. Thus, in this work, size optimization is combined with the reliability-based design optimization (RBDO) method to improve the performance of accelerometers. To account for uncertainties in the dimensions and material properties of these devices, the first order reliability method is applied to calculate the probabilities involved in the RBDO formulation. Practical examples of bulk-type capacitive accelerometer designs are presented and discussed to evaluate the potential of the implemented RBDO solver. ARTICLE HISTORY

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“…This suggested geometry (Figure 2), the dimensions of which are presented in Table 1, has been employed as a spring for a high-performance accelerometer (Rodrigues et al 2011).…”

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Deterministic Solutionmentioning

confidence: 99%

Section: Deterministic Solutionmentioning

confidence: 99%

See 3 more Smart Citations

Structural design of high-performance capacitive accelerometers using parametric optimization with uncertainties

Teves

Lima

Passaro³

et al. 2016

Engineering Optimization

Self Cite

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MEMS capacitive accelerometer: dynamic sensitivity analysis based on analytical squeeze film damping and mechanical thermoelasticity approaches

Silva¹,

Rodrigues²,

Passaro³

et al. 2019

SN Appl. Sci.

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In this work, we adopt a semi-analytical model to study a capacitive MEMS accelerometer based in silicon (Si). Such model takes into account the thermoelastic stiffness and linear expansion coefficients of anisotropic bulk Si. In addition, an analytical damping model, derived from the Reynolds equation, is incorporated in the model, in order to study dynamical characteristics of a MEMS capacitive accelerometer. Such approach takes into account the inertial effects on squeeze film damping in air, argon and helium gases, assumed as being ideal gases. The simulation model was compared with experimental measurements. The main figure of merit adopted is the electromechanical sensitivity (S EM), assuming frequency response and considering the effect of gas pressure, as well as temperature, on the damping loss mechanisms in such devices. The resulted model implementation shows a good agreement with the experimental data. For all gases, the sensitivity at 20 Pa presents less variation than at 200 Pa. At 20 Pa, the linear response of the device reaches up to 300 Hz, approximately, for air and helium, assuming variation of ≈ 0.5 dB, no matter which temperature. For 200 Pa, the linear response drops down to about 150 Hz. Also, for the three gases, the variation of S EM as a function of temperature is below 0.17 dB in the entire operational range, for both evaluated pressures, depending only on the silicon mechanical properties at low frequencies.

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Otimização de acelerômetros MEMS eletroestáticos de alto desempenho.

Teves¹

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Microssistemas eletromecânicos ou "Micro-Electro-Mechanical Systems (MEMS)", representam uma classe de dispositivos que combinam funções mecânicas e eletrônicas em escala micrométrica. Através do uso de técnicas de microfabricação, adaptadas da indústria de semicondutores, é realizada a integração entre estruturas móveis, sensores, atuadores e eletrônica, tornando possível a implementação de sistemas completos miniaturizados. Acelerômetros eletrostáticos estão entre os dispositivos MEMS mais comercializados hoje em dia, com venda anual em todo o mundo superior a 100 milhões de unidades e crescente a cada ano. Eles são geralmente fabricados utilizando-se três lâminas de silício espessas, coladas uma sobre a outra. A camada intermediária é obtida por processos de corrosão e consiste de uma 'grande' massa de prova suspensa por uma ou mais vigas. Ela é separada das lâminas superior e inferior por um pequeno espaço vazio (gap), dando origem a dois conjuntos de capacitores de placas paralelas. A flexibilidade das vigas permite que a massa se mova proporcionalmente à aceleração externa e o seu deslocamento é estimado pela variação da capacitância do conjunto. O projeto destes sensores é uma tarefa complexa, já que os seus diversos requisitos de desempenho são, na maioria das vezes, conflitantes, isto é, se o projeto é modificado para melhorar uma característica, as demais são inevitavelmente afetadas e por isso técnicas de otimização devem ser utilizadas na etapa de projeto. Com o intuito de melhorar o desempenho de micro-acelerômetros capacitivos, são então propostas e avaliadas no atual trabalho duas técnicas de otimização distintas, sendo uma delas baseada em Otimização Paramétrica (OP) e a outra no Método da Otimização Topológica (MOT). A OP parte de uma topologia previamente definida e adota algumas de suas características geométricas como variáveis de projeto. Para levar em consideração incertezas nas dimensões e propriedades dos materiais, que é um elemento-chave na concepção e fabricação de dispositivos MEMS, neste trabalho a OP é combinada com o método da Otimização de Projeto Baseado em Confiabilidade ou "Reliability-based Design Optimization (RBDO)". Análises de confiabilidade de primeira ordem através do Método de Confiabilidade de Primeira Ordem, ou "First-Order Reliability Method (FORM)", são utilizadas para o cálculo das probabilidades envolvidas nesta formulação. Já o MOT combina o Método dos Elementos Finitos (MEF) e um modelo de material com algoritmos de otimização para encontrar a distribuição ótima de material em um domínio de projeto pré-estabelecido. As variáveis de projeto são as pseudo-densidades que descrevem a quantidade de material em cada ponto do domínio. Na modelagem pelo MEF utiliza-se elementos de placa estrutural do tipo "Mixed Interpolation of Tensorial Components (MITC)". Exemplos práticos utilizando ambas as abordagens são apresentados e os seus resultados discutidos com o intuito de se avaliar o potencial de cada técnica para o projeto de micro-acelerômetros capacitivos.

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Dynamic modeling of a silicon bulk-micromachined microaccelerometer

Cited by 3 publications

References 9 publications

Structural design of high-performance capacitive accelerometers using parametric optimization with uncertainties

Structural design of high-performance capacitive accelerometers using parametric optimization with uncertainties

MEMS capacitive accelerometer: dynamic sensitivity analysis based on analytical squeeze film damping and mechanical thermoelasticity approaches

Otimização de acelerômetros MEMS eletroestáticos de alto desempenho.

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