Dynamic Mechanical Properties and Microstructural Studies of Lead‐Free Solders in Electronic Packaging

Dynamic response of electronic materials to impact loading: review

“…, Williamson et al , Tan et al. , Steinberg . The results have shown a clear need for consistent and trustworthy experimental data for high rates of strain, which are relevant to the loading environment for portable electronic devices experiencing impact loading.…”

“…The published work that addresses the mechanical behavior and performance of tin‐lead and lead‐free BGA solder materials and interconnections, when subjected to thermal or dynamic loading, is enormous. In this section we will indicate just a few major publications that do not necessarily address board‐level testing per se (the next section will be devoted to this important field) and employ, in addition to experimental evaluations, also modeling techniques.…”

“…In the review that follows we consider publications addressing the dynamic response of electronic materials to shocks and vibrations ; role, significance and attributes of predictive modeling ; the situations when it is sufficient to consider the deterministic (non‐deterministic) linear response and when nonlinear and probabilistic effects are significant and cannot be ignored. The emphasis of the review is on the reliability of solder joint interconnections and especially on the board‐level drop testing [–112] of solder materials and systems used as the second‐level of interconnections (package‐to‐substrate): printed circuit boards (PCBs) carrying surface mounted devices (SMDs). It is the board‐level drop testing that has become the most popular way to establish if, based on the existing qualification standards, the reliability of the second level of the interconnections is adequate.…”