2004
DOI: 10.1016/j.compstruct.2003.12.008
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Dynamic and static modelling of piezoelectric composite structures using a thermal analogy with MSC/NASTRAN

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Cited by 63 publications
(20 citation statements)
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“…MSC/NASTRAN, despite being as widely used, did not posses an inherent modeling approach for piezoelectricity which led to the development of an alternative thermal strain analogy approach and a modified coupled-field finite element approach (Freed and Babuska 1997). The thermal analogy has been shown to be reasonably accurate in terms of static deformation but transient behaviour can require unwieldy models and accurate modeling of any insulating layers is needed to accurately capture dynamic behaviour Côté et al (2004). As a result, it has been investigated further and adopted by many different researchers when modeling the piezoelectricinduced strain (Paradies and Ciresa 2009;Tawfik et al 2011;Bilgen et al 2011;Gustafson 2011;Dwarakanathan et al 2015).…”
Section: Macro Fiber Compositementioning
confidence: 99%
See 1 more Smart Citation
“…MSC/NASTRAN, despite being as widely used, did not posses an inherent modeling approach for piezoelectricity which led to the development of an alternative thermal strain analogy approach and a modified coupled-field finite element approach (Freed and Babuska 1997). The thermal analogy has been shown to be reasonably accurate in terms of static deformation but transient behaviour can require unwieldy models and accurate modeling of any insulating layers is needed to accurately capture dynamic behaviour Côté et al (2004). As a result, it has been investigated further and adopted by many different researchers when modeling the piezoelectricinduced strain (Paradies and Ciresa 2009;Tawfik et al 2011;Bilgen et al 2011;Gustafson 2011;Dwarakanathan et al 2015).…”
Section: Macro Fiber Compositementioning
confidence: 99%
“…The relationship of equation (7) concludes that the piezoelectric-driven expansion and contraction can be represented through a thermal load applied to the modeled actuator (Côté et al, 2004). This is quite useful when working with commercial FE software since it allows the piezoelectric actuation to be treated as a thermal expansion property of the material.…”
Section: Fe Modelmentioning
confidence: 99%
“…Finite element analysis (FEA) is used to compute the displacement and natural frequency of the mechanism without load and further check the stress intensity based on an NX V8.0.0.25 NASTRAN solver [24,25] of Siemens AG in Berlin, Germany, shown in Figure 2. The maximum Von Mises stress 47.63 MPa of the mechanism in Figure 2b is lower than the allowable stress 355 MPa in Table 2.…”
Section: Structure Designmentioning
confidence: 99%
“…Simulation, as an effective alternative of physical testing in terms of both cost and time, allows more design options to be considered in a shorter time (Sellgren 1994(Sellgren , 1995. Thus, various simulation systems, including Ansys, Abaqus, MSC Nastran, etc., have been developed to the needs of developing domain-specific simulations (Côté et al 2004). Therefore, simulation-driven design is becoming the mainstream product design and development process.…”
Section: Introductionmentioning
confidence: 99%