Ductile Regime Finish Machining - A Review

Ngoi, B. K. A.; Sreejith, P. S.

doi:10.1007/s001700070043

Cited by 70 publications

(28 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[23][24][25][26][27][28] In ductile regime machining of brittle materials, the material removal takes place with plastic deformation of the grains. 23,24,[26][27][28]31 While the material removal is in ductile mode, brittle fracture is still observed in ductile regime grinding. 24,28 The material removal and damage formation in the wire saw process is analogous to ductile regime grinding as seen from SEM images of wire saw processed surfaces.…”

Section: Resultsmentioning

confidence: 99%

Roughness damage evolution due to wire saw process

Teomete

2011

Int. J. Precis. Eng. Manuf.

View full text Add to dashboard Cite

The wire saw process is widely used for silicon wafer production with high yield and low surface damage in solar cell and microelectronics industries. The wire saw process is used to machine brittle materials in the ductile regime where high yield and low surface damage are desired. The wire saw process is also used to cut concrete and rocks in civil engineering. In this study, an experimental parametric study was conducted by varying process parameters to determine surface roughness damage. Ductile regime material removal by trans-granular failure and brittle fracture by inter-granular failure are observed in electron micrographs of the cut surfaces. A damage model that relates the roughness damage to process parameters was derived. The damage model predicts the roughness damage satisfactorily. The model shows that the roughness damage is proportional to the ratio of feed speed to wire speed. Improvement in the efficiency of the process without increasing the roughness damage can be attained by increasing the feed speed proportionally to wire speed. Wire tension does not affect roughness damage. Roughness damage, however, is affected by properties of the wire. Wires having smaller grit radius and small grit spacing cause less roughness damage.

show abstract

Section: Resultsmentioning

confidence: 99%

Roughness damage evolution due to wire saw process

Teomete

2011

Int. J. Precis. Eng. Manuf.

View full text Add to dashboard Cite

show abstract

“…It has been shown that if the depth of cut is lower than a certain critical depth, calculated with the undeformed chip thickness theory, ductile streaks could be obtained [5,[9][10][11][12]. For higher depth of cut, different damages can be generated.…”

Section: Introductionmentioning

confidence: 98%

On Material Removal Regimes for the Shaping of Glass Edges: Force Analysis, Surface Topography and Damage Mechanisms

2008

View full text Add to dashboard Cite

show abstract

“…Both effects are enhanced with the increase of in-feed rate or by mechanical vibrations of the capillary during its grinding. The essential condition necessary for the sharp capillary edge achieving is to ensure ductile regime [16,17] of surface removal. This condition, however, is not sufficient condition for satisfaction sharp edge manufacturing, because small defects appear on the machining edge under ductile regime too as it is seen in the figure 3.…”

Section: Experimental Conditionsmentioning

confidence: 99%

Reducing the Edge Chipping for Capillary End Face Grinding and Polishing

Hošek

Studenovský

2013

EPJ Web of Conferences

View full text Add to dashboard Cite

Abstract. This paper presents results of glass capillary end face grinding and polishing by approach that reduces the edge chipping. Brittle materials have natural tendency for edge chipping what leads to beveling the sharp edges. Not beveled sharp edges on glass capillary are important for special applications like surface tension measurement of small liquid samples. We use common grinding and polishing process for capillary end face machining modified with gradual decreasing of grinding load based on the relation of the critical chipping load. Achieved surface roughness is measured using atomic force microscopy (AFM). Capillary inner edge quality is checked both with optical microscopes and electron microscope too. We achieved a non-chipped capillary inner edge with radius down to 100 nm.

show abstract

Ductile Regime Finish Machining - A Review

Cited by 70 publications

References 11 publications

Roughness damage evolution due to wire saw process

Roughness damage evolution due to wire saw process

On Material Removal Regimes for the Shaping of Glass Edges: Force Analysis, Surface Topography and Damage Mechanisms

Reducing the Edge Chipping for Capillary End Face Grinding and Polishing

Contact Info

Product

Resources

About