2008
DOI: 10.1109/tim.2008.926379
|View full text |Cite
|
Sign up to set email alerts
|

Dual Experimental Approach for Thermal Impacts on Electromagnetic Behavior of Electronic Circuit Board Configurations

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
5
0

Year Published

2015
2015
2022
2022

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(5 citation statements)
references
References 8 publications
0
5
0
Order By: Relevance
“…Electromagnetic probes have been fabricated with highfrequency semi-rigid coaxial cable to inject RF power from MHz until 3GHz [11]. A warming plate, using inductive heating, is used to generate temperature until 300-350°C over a fixed glass area.…”
Section: A Near-field Aggression Test Benchmentioning
confidence: 99%
See 1 more Smart Citation
“…Electromagnetic probes have been fabricated with highfrequency semi-rigid coaxial cable to inject RF power from MHz until 3GHz [11]. A warming plate, using inductive heating, is used to generate temperature until 300-350°C over a fixed glass area.…”
Section: A Near-field Aggression Test Benchmentioning
confidence: 99%
“…Acquisition of real external temperature close on board is realized by thin thermal resistor in SMD or Thin Film technology. A special attention has been made, for pertinent immunity measurements, with the thermal routing network [11]. A specific roadmap procedure and computational algorithm has been developed to drive the experiment and all the postprocessing data's.…”
Section: B Tem Cell Aggression Test Benchmentioning
confidence: 99%
“…The electromagnetic compatibility (EMC) and thermal behavior, have to be carefully considered for these appliances in order to obtain reliable and safety systems [4][5][6]. In fact, the process of integration and the use of higher switching speeds increase the electromagnetic emissions generated by PMs, that can interfere with electric/electronic devices that share the same electromagnetic environment of PM.…”
Section: Introductionmentioning
confidence: 99%
“…The reduction of the PM surface, with restricted spaces between the components and short connection circuits that gives benefits for the EMC problems, enhances, on the other hand, thermal coupling increasing the overall module temperature. Hence, these two aspects has to be studied and tested together [5][6]. In [6] an optimization IPMs design regarding thermal and EMC constraints is analyzed and proposed, while [5] deals with a study of the effects of temperature on electromagnetic behavior in new integrated complex electronic structures.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation