Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics
Zabihollah Ahmadi,
Aarsh Patel,
Curtis Hill
et al.
Abstract:Additive manufacturing of functional devices on various
rigid and
flexible substrates is rising rapidly due to their design flexibility,
rapid manufacturing, and lower cost. Current printing technologies
are ink-based and focused on printing silver (Ag) as conductive lines
due to its matured ink formulation process, low sintering temperature,
ease of printing, and low oxidation rate. However, Ag is the 68th
most abundant element on Earth, while copper (Cu) is the 25th, making
it much cheaper (>100×) while havi… Show more
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